Authors:
Shigeyuki Takagi
1
;
Hirotaka Tanimura
1
;
Tsutomu Kakuno
2
;
Rei Hashimoto
2
and
Shinji Saito
2
Affiliations:
1
School of Engineering, Tokyo University of Technology, 1404-1, Katakura-cho, Hachioji city, Tokyo and Japan
;
2
Coporated Manufacturing Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo Ward, Yokohama-city and Japan
Keyword(s):
Quantum Cascade Lasers, QCLs, Statics Method, Dynamic Method, Heat Resistance, Three-dimensional Simulation.
Related
Ontology
Subjects/Areas/Topics:
Lasers
;
Photonic and Optoelectronic Materials and Devices
;
Photonics
;
Photonics, Optics and Laser Technology
;
Semiconductor Lasers and Leds
Abstract:
In order to increase the output of quantum cascade lasers (QCLs), it is important to improve the heat dissipation. For investigating the relationship between the device structure and heat dissipation properties, three kinds of different QCL devices were prepared as follows. One is a device which has the ridge covered with SiO2 and thin Au, another is a device which has the ridge covered with SiO2 embedded with Au, and the other is a device which has the ridge covered with SiO2 embedded with Cu. The temperature distributions was measured with a thermos-viewer. In addition, relationship between structure and heat dissipation properties in these structure devices are analysed with a three-dimensional model. As a result, it was clarified from experiments and simulations to improve heat dissipation properties by embedding ridge with Au or Cu. Furthermore, the thermal properties of the QCL device was measured by the statics method to separate the thermal resistance of the ridge, that of su
bstrate, and that of mount parts. It was shown that the thermal resistance improves by more than 2 K/W from 9.3 K/W to 6.9 K/W by embedding ridge with Au or Cu.
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