TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA

Beibei Ma, Seán McLoone, John Ringwood

Abstract

This paper explores the application of principal component analysis (PCA) to the monitoring of within-lot and between-lot plasma variations that occur in a plasma etching chamber used in semiconductor manufacturing, as observed through Optical Emission Spectroscopy (OES) analysis of the chamber exhaust. Using PCA, patterns that are difficult to identify in the 2048-dimension OES data are condensed into a small number of principle components (PCs). It is shown, with the aid of experimental data, that by simply tracking changes in the directions of these PCs both inter-lot and intra-lot patterns can be identified.

References

  1. Sugawara, M., 1998. Plasma Etching: Fundamentals and applications, Oxford University Press, New York.
  2. Splichal, M., Anderson, H., 1987. Application of Chemometrics to Optical Emission Spectroscopy for Plasma Monitoring. Proc. SPIE, 2, pp. 189-203.
  3. Jackson, J. E., 1991. A User's Guide to Principal Components, Wiley Interscience Press, New York.
  4. Geladi, P., Kowalski, R. B., 1986. Partial least-squares regression: a tutorial. Analytica Chimica. Acta., 185, pp.1-17.
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Paper Citation


in Harvard Style

Ma B., McLoone S. and Ringwood J. (2007). TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA . In Proceedings of the Fourth International Conference on Informatics in Control, Automation and Robotics - Volume 3: ICINCO, ISBN 978-972-8865-84-9, pages 361-364. DOI: 10.5220/0001629303610364


in Bibtex Style

@conference{icinco07,
author={Beibei Ma and Seán McLoone and John Ringwood},
title={TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA},
booktitle={Proceedings of the Fourth International Conference on Informatics in Control, Automation and Robotics - Volume 3: ICINCO,},
year={2007},
pages={361-364},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0001629303610364},
isbn={978-972-8865-84-9},
}


in EndNote Style

TY - CONF
JO - Proceedings of the Fourth International Conference on Informatics in Control, Automation and Robotics - Volume 3: ICINCO,
TI - TRACKING PLASMA ETCH PROCESS VARIATIONS USING PRINCIPAL COMPONENT ANALYSIS OF OES DATA
SN - 978-972-8865-84-9
AU - Ma B.
AU - McLoone S.
AU - Ringwood J.
PY - 2007
SP - 361
EP - 364
DO - 10.5220/0001629303610364