THE DESIGN OF BIAXIAL JOINT FOR MOBILE ELECTRONICS WITH THE ANALYSIS ON ARTHROSIS

Zhao Danpu, Yi Qiang, Nie Chenghui, Chen Ken, Liu Li, Xu Leon, Salo Antti

Abstract

To bring forward the new form factors is one of the key drivers for future mobile electronic devices. On the other hand, some form factors in nature with evolution process have been the excellent and adaptive. In this paper, we pay attention to the characteristics of arthrosis, researched on the difference between the arthrosis and machine joint. Then the essentials and parameters of the biaxial joint design were introduced. After that a biaxial joint concept for portable electronics based on the bionic principle was proposed. Finally, we provided the statics analysis of the biaxial joint.

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Paper Citation


in Harvard Style

Danpu Z., Qiang Y., Chenghui N., Ken C., Li L., Leon X. and Antti S. (2008). THE DESIGN OF BIAXIAL JOINT FOR MOBILE ELECTRONICS WITH THE ANALYSIS ON ARTHROSIS . In Proceedings of the First International Conference on Biomedical Electronics and Devices - Volume 1: BIODEVICES, (BIOSTEC 2008) ISBN 978-989-8111- 17-3, pages 138-142. DOI: 10.5220/0001048101380142


in Bibtex Style

@conference{biodevices08,
author={Zhao Danpu and Yi Qiang and Nie Chenghui and Chen Ken and Liu Li and Xu Leon and Salo Antti},
title={THE DESIGN OF BIAXIAL JOINT FOR MOBILE ELECTRONICS WITH THE ANALYSIS ON ARTHROSIS},
booktitle={Proceedings of the First International Conference on Biomedical Electronics and Devices - Volume 1: BIODEVICES, (BIOSTEC 2008)},
year={2008},
pages={138-142},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0001048101380142},
isbn={978-989-8111- 17-3},
}


in EndNote Style

TY - CONF
JO - Proceedings of the First International Conference on Biomedical Electronics and Devices - Volume 1: BIODEVICES, (BIOSTEC 2008)
TI - THE DESIGN OF BIAXIAL JOINT FOR MOBILE ELECTRONICS WITH THE ANALYSIS ON ARTHROSIS
SN - 978-989-8111- 17-3
AU - Danpu Z.
AU - Qiang Y.
AU - Chenghui N.
AU - Ken C.
AU - Li L.
AU - Leon X.
AU - Antti S.
PY - 2008
SP - 138
EP - 142
DO - 10.5220/0001048101380142