AOI BASED NEUROFUZZY SYSTEM TO EVALUATE SOLDER JOINT QUALITY

G. Acciani, G. Brunetti, G. Fornarelli, A. Giaquinto, D. Maiullari

Abstract

Surface Mount Technology is extensively used in the production of Printed Circuit Boards due to the high level of density in the electronic device integration. In such production process several defects could occur on the final electronic components, compromising their correct working. In this paper a neurofuzzy solution to process information deriving from an automatic optical system is proposed. The designed solution provides a Quality Index of a solder joint, by reproducing the modus operandi of an expert and making it automatic. Moreover, the considered solution presents some attractive advantages: a complex acquisition system is not needed, reducing the equipment costs and shifting the assessment of a solder joint on the fuzzy parts. Finally, the typical low computational costs of the fuzzy systems could satisfy urgent time constrains in the in-line detection of some industrial productive processes.

References

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Paper Citation


in Harvard Style

Acciani G., Brunetti G., Fornarelli G., Giaquinto A. and Maiullari D. (2009). AOI BASED NEUROFUZZY SYSTEM TO EVALUATE SOLDER JOINT QUALITY . In Proceedings of the 11th International Conference on Enterprise Information Systems - Volume 2: ICEIS, ISBN 978-989-8111-85-2, pages 51-54. DOI: 10.5220/0001859300510054


in Bibtex Style

@conference{iceis09,
author={G. Acciani and G. Brunetti and G. Fornarelli and A. Giaquinto and D. Maiullari},
title={AOI BASED NEUROFUZZY SYSTEM TO EVALUATE SOLDER JOINT QUALITY},
booktitle={Proceedings of the 11th International Conference on Enterprise Information Systems - Volume 2: ICEIS,},
year={2009},
pages={51-54},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0001859300510054},
isbn={978-989-8111-85-2},
}


in EndNote Style

TY - CONF
JO - Proceedings of the 11th International Conference on Enterprise Information Systems - Volume 2: ICEIS,
TI - AOI BASED NEUROFUZZY SYSTEM TO EVALUATE SOLDER JOINT QUALITY
SN - 978-989-8111-85-2
AU - Acciani G.
AU - Brunetti G.
AU - Fornarelli G.
AU - Giaquinto A.
AU - Maiullari D.
PY - 2009
SP - 51
EP - 54
DO - 10.5220/0001859300510054