Embedding and Parsing Combined for Efficient Language Design

Gergely Dévai, Dániel Leskó, Máté Tejfel

Abstract

One way to develop domain specific languages is to define their concrete syntax and create support for it using classical compiler technology (maybe with the support of language workbenches). A different way is to create an embedded language, which is implemented as a special library written in a host language. The first approach is usually too costly in the first phase of the language design when the language evolves and changes quickly. Embedded languages are more lightweight and support the language experiments better. On the other hand, they are not that convenient for the end-users as the standalone languages. This paper presents the lessons learnt from a DSL development research project in industry-university cooperation, that combined the advantages of the two approaches: the flexibility of embedding in the design phase and the convenience of a standalone language in the final product.

References

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Paper Citation


in Harvard Style

Dévai G., Leskó D. and Tejfel M. (2013). Embedding and Parsing Combined for Efficient Language Design . In Proceedings of the 8th International Joint Conference on Software Technologies - Volume 1: ICSOFT-EA, (ICSOFT 2013) ISBN 978-989-8565-68-6, pages 244-250. DOI: 10.5220/0004591802440250


in Bibtex Style

@conference{icsoft-ea13,
author={Gergely Dévai and Dániel Leskó and Máté Tejfel},
title={Embedding and Parsing Combined for Efficient Language Design},
booktitle={Proceedings of the 8th International Joint Conference on Software Technologies - Volume 1: ICSOFT-EA, (ICSOFT 2013)},
year={2013},
pages={244-250},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0004591802440250},
isbn={978-989-8565-68-6},
}


in EndNote Style

TY - CONF
JO - Proceedings of the 8th International Joint Conference on Software Technologies - Volume 1: ICSOFT-EA, (ICSOFT 2013)
TI - Embedding and Parsing Combined for Efficient Language Design
SN - 978-989-8565-68-6
AU - Dévai G.
AU - Leskó D.
AU - Tejfel M.
PY - 2013
SP - 244
EP - 250
DO - 10.5220/0004591802440250