On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules

Marco Iachello

Abstract

This research focuses on the development of a new thermal modelling methodology of multichip electronic power modules. The current stage of the research is intermediate. In the first step the implementation of simulations for collecting thermal data on high power modules has been performed. The current step is the development of the methodology for lumped parameter models extraction. The main aim of this project is to generate an optimized procedure for the design of lumped parameter thermal models extracted from 3D-field simulations or experimental measurements.

References

  1. Y. B. Wu, G. Y. Liu, N. H. Xu and Z. C. Dou, “Thermal Resistance Analysis and Simulation of IGBT Module with High Power Density”, Applied Mechanics and materials Vols 303-306, pp 1902-1907, 2013.
  2. I. Swan, A. Bryant, P. A. Mawby, T. Ueta, T. Nishijima, and K. Hamada, “A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module”, IEEE Transactions on power electronics, vol. 27, no. 1, January 2012
  3. I. R. Swan, A. T. Bryant, and P. A. Mawby, “Fast 3D thermal simulation of power module packaging”, Int. J. Numer. Model., vol 25, pp 378-399, July 2012.
  4. S. Dutta, B. Parkhideh, S. Bhattacharya, G. K. Moghaddam, R. Gould “Development of a Predictive Observer Thermal Model for Power Semiconductor Devices for Overload Monitoring in High Power High Frequency Converters”, Applied Power Electronics Conference and Exposition (APEC), pp 2305-2310, February 2012
  5. U. Drofenik, D. Cottet, A. Musing, J-M. Meyer and J. W. Kolar, “Computationally Efficent Integration of Complex Thermal Multi-Chip Power Module Models into Circuit Simulators”, Power Conversion Conference, Nagoya, 2007.
  6. Z. Khatir, S. Carubelli and F. Lecoq, “Real-Time Computation of Thermal Constraints in Multichip Power Electronics Devices”, IEEE Transaction on components and packaging technologies, Vol. 27, No. 2, June 2004.
  7. S. Carubelli, Z. Khatir, “Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions”, Microelectronics Journal 34, pp.1143-1151, 2003.
  8. R. W. Lewis, K. Morgan, H. R. Thomas and K. N. Seetharamu, The Finite Element Method in Heat Transfer Analysis. New York: Wiley, 1996.
  9. C. S. Yun, P. Regli, J. WaldMeyer, and W. Fichtner, “Static and dynamic thermal characteristics of IGBT power modules”, In Proc. 11th Int. Symp. Power Semiconductor Devices & ICs, pp. 37-40, May 1999.
  10. Z. Khatir, S. Lefebvre, “Thermal Analysis of Power Cycling Effects on High Power IGBT Modules by the Boundary Element Method”, Semiconductor Thermal Measurement and Management, Seventeeth Annual IEEE Symposius, 2001.
  11. F. Profumo, A. Tenconi, S. Facelli, B. Passerini, “Implementation and Validation of a New Thermal Model for Analysis, Design, and Characterization of Multichip Power electronics Devices”, IEEE Transaction on industry applications, vol. 35, no. 3, May/June 1999.
  12. N. Y. A. Shammas, M. P. Rodriguez, F. Masana, “A simple method for evaluating the transient thermal response of semiconductor devices”, Microelectronics Reliability 42, pp. 109-117, 2002.
  13. Y. A. Cengel, Heat Transfer: A practical Approach, Mcgraw-Hill, 2nd edition, 2002.
  14. Infineon Ltd, Thermal equivalent circuit models, Application Note, v1.0, 2008 published at http://www.infineon.com.
Download


Paper Citation


in Harvard Style

Iachello M. (2013). On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules . In Doctoral Consortium - Doctoral Consortium, (ICINCO 2013) ISBN Not Available, pages 3-7. DOI: 10.5220/0004636900030007


in Bibtex Style

@conference{doctoral consortium13,
author={Marco Iachello},
title={On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules},
booktitle={Doctoral Consortium - Doctoral Consortium, (ICINCO 2013)},
year={2013},
pages={3-7},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0004636900030007},
isbn={Not Available},
}


in EndNote Style

TY - CONF
JO - Doctoral Consortium - Doctoral Consortium, (ICINCO 2013)
TI - On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules
SN - Not Available
AU - Iachello M.
PY - 2013
SP - 3
EP - 7
DO - 10.5220/0004636900030007