On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules

Marco Iachello


This research focuses on the development of a new thermal modelling methodology of multichip electronic power modules. The current stage of the research is intermediate. In the first step the implementation of simulations for collecting thermal data on high power modules has been performed. The current step is the development of the methodology for lumped parameter models extraction. The main aim of this project is to generate an optimized procedure for the design of lumped parameter thermal models extracted from 3D-field simulations or experimental measurements.


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Paper Citation

in Harvard Style

Iachello M. (2013). On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules . In Doctoral Consortium - Doctoral Consortium, (ICINCO 2013) ISBN Not Available, pages 3-7. DOI: 10.5220/0004636900030007

in Bibtex Style

@conference{doctoral consortium13,
author={Marco Iachello},
title={On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules},
booktitle={Doctoral Consortium - Doctoral Consortium, (ICINCO 2013)},
isbn={Not Available},

in EndNote Style

JO - Doctoral Consortium - Doctoral Consortium, (ICINCO 2013)
TI - On the Investigation of Lumped Parameter Models for Thermal Characterization of High Power Modules
SN - Not Available
AU - Iachello M.
PY - 2013
SP - 3
EP - 7
DO - 10.5220/0004636900030007