Study on Optimization of Fatigue Test of Nanosilver Solder

Hui Yang, Yang Zhang, Ji hui Wu

Abstract

Nanosilver solder paste due to its high melting point, low sintering temperature and good electrical/thermal conductivity and mechanical reliabilitySex, more and more attention by the electronic packaging industry. And, as a new type of lead-free thermal interfaceMaterials, nano-silver solder paste has the potential to gradually replace traditional solder and conductive silver paste, used in high-temperature power electronicsIn thedevice packaging, according to the isothermal mechanicalfatigue test,a temperature-dependent fatigue life prediction model is proposed, and the cycle life of the nanosilver solder paste lap joint at different temperatures is accurately predicted.

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Paper Citation


in Harvard Style

Yang H., Zhang Y. and Wu J. (2018). Study on Optimization of Fatigue Test of Nanosilver Solder.In Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM, ISBN 978-989-758-345-2, pages 112-115. DOI: 10.5220/0007527301120115


in Bibtex Style

@conference{icimm18,
author={Hui Yang and Yang Zhang and Ji hui Wu},
title={Study on Optimization of Fatigue Test of Nanosilver Solder},
booktitle={Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM,},
year={2018},
pages={112-115},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0007527301120115},
isbn={978-989-758-345-2},
}


in EndNote Style

TY - CONF

JO - Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM,
TI - Study on Optimization of Fatigue Test of Nanosilver Solder
SN - 978-989-758-345-2
AU - Yang H.
AU - Zhang Y.
AU - Wu J.
PY - 2018
SP - 112
EP - 115
DO - 10.5220/0007527301120115