The Stamping Springback Compensation Technology Study for An Auto B Pillar

Guanglin Shi, Jinhai Cheng, Shaowen Lv, Xuezhao Zhou

Abstract

The stamping spring back problem of a sheet metal is always a difficult point to solve in production, and it also becomes a hot issue in academic circle. This paper introduced a method to reduce the springback deformation of an auto B pillar. A Handy Scanner was used to acquire the points cloud datum of a drawn B pillar; afterwards, all surfaces of this part were reconstructed in the Geomagic Studio software, taking advantage of this datum. Consequently, the dimension difference between the reconstruction and primitive numerical model was obtained by using the Geomagic Qualify Probe software, and it was the springback value of this auto B pillar after drawn. To reduce the springback value of this part, according to the positions presenting springback maximum, some offset dimensions on stamping die surfaces were compensated. Finally, DYNAFORM software was used to simulate the forming process with the improved die, to analyse the improved springback results of this part. The result shows this method is effective to reduce springback.

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Paper Citation


in Harvard Style

Shi G., Cheng J., Lv S. and Zhou X. (2018). The Stamping Springback Compensation Technology Study for An Auto B Pillar.In Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM, ISBN 978-989-758-345-2, pages 354-358. DOI: 10.5220/0007531703540358


in Bibtex Style

@conference{icimm18,
author={Guanglin Shi and Jinhai Cheng and Shaowen Lv and Xuezhao Zhou},
title={The Stamping Springback Compensation Technology Study for An Auto B Pillar},
booktitle={Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM,},
year={2018},
pages={354-358},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0007531703540358},
isbn={978-989-758-345-2},
}


in EndNote Style

TY - CONF

JO - Proceedings of the 2nd International Conference on Intelligent Manufacturing and Materials - Volume 1: ICIMM,
TI - The Stamping Springback Compensation Technology Study for An Auto B Pillar
SN - 978-989-758-345-2
AU - Shi G.
AU - Cheng J.
AU - Lv S.
AU - Zhou X.
PY - 2018
SP - 354
EP - 358
DO - 10.5220/0007531703540358