Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions

Mariia Kepper, Pol Ribes-Pleguezuelo, Marcel Hornaff, Erik Beckert, Ramona Eberhardt, Pascal Pranyies, Isabelle Toubhans, Francis Descours, Andreas Tünnermann

Abstract

The goal of our study is to optimize the packaging process of an optical sensor module under the space mission requirements. The intention of the project is to develop a generation of optical sensor modules avoiding conventional organic adhesives (standard used technologies). The sensor module, designed by Sodern, consists of three parts: the sensor, the filter frame and the filter. The Solderjet Bumping is planned to be used for assembling KOVAR(29 % Ni, 17 % Co, 54 % Fe) and N-BK10 (Borosilicate-Kronglas, Schott glass) and for assembling KOVAR and KOVAR materials, chosen for this application, and creation of a strong bond between these materials, which should withstand the harsh environmental space conditions.

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Paper Citation


in Harvard Style

Kepper M., Ribes-Pleguezuelo P., Hornaff M., Beckert E., Eberhardt R., Pranyies P., Toubhans I., Descours F. and Tünnermann A. (2019). Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions.In Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS, ISBN 978-989-758-364-3, pages 85-93. DOI: 10.5220/0007525100850093


in Bibtex Style

@conference{photoptics19,
author={Mariia Kepper and Pol Ribes-Pleguezuelo and Marcel Hornaff and Erik Beckert and Ramona Eberhardt and Pascal Pranyies and Isabelle Toubhans and Francis Descours and Andreas Tünnermann},
title={Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions},
booktitle={Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS,},
year={2019},
pages={85-93},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0007525100850093},
isbn={978-989-758-364-3},
}


in EndNote Style

TY - CONF

JO - Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology - Volume 1: PHOTOPTICS,
TI - Soldering and Packaging Study for an Optical Filter Required for High Resolution Earth Observation Space Missions
SN - 978-989-758-364-3
AU - Kepper M.
AU - Ribes-Pleguezuelo P.
AU - Hornaff M.
AU - Beckert E.
AU - Eberhardt R.
AU - Pranyies P.
AU - Toubhans I.
AU - Descours F.
AU - Tünnermann A.
PY - 2019
SP - 85
EP - 93
DO - 10.5220/0007525100850093