Practical Implementation of Diode SPICE Model with Reverse Recovery

Denys Zaikin

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Paper

Practical Implementation of Diode SPICE Model with Reverse Recovery

Topics: Clean Energy and Power Systems; Energy Systems; Laboratory Simulation Software; Materials

In Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications SIMULTECH - Volume 1, 92-96, 2023 , Rome, Italy

Author: Denys Zaikin

Affiliation: Advent Technologies A/S, Lyngvej 8, Aalborg DK-9000, Denmark

Keyword(s): Diode Reverse Recovery, SPICE, Circuit Simulation.

Abstract: Peter O. Lauritzen and Cliff L. Ma proposed an approach for creating a physical model of reverse recovery for soft recovery diodes in 1991. The current paper demonstrates how to create the proper SPICE sub-circuit using only the specifications from the diode datasheet from the manufacturer. Software for characterization tools has been developed, tested, and is now openly accessible for use.

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Paper citation in several formats:

Zaikin, D. (2023). Practical Implementation of Diode SPICE Model with Reverse Recovery. In Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - SIMULTECH; ISBN 978-989-758-668-2; ISSN 2184-2841, SciTePress, pages 92-96. DOI: 10.5220/0012096500003546

@conference{simultech23,
author={Denys Zaikin},
title={Practical Implementation of Diode SPICE Model with Reverse Recovery},
booktitle={Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - SIMULTECH},
year={2023},
pages={92-96},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0012096500003546},
isbn={978-989-758-668-2},
issn={2184-2841},
}

TY - CONF

JO - Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - SIMULTECH
TI - Practical Implementation of Diode SPICE Model with Reverse Recovery
SN - 978-989-758-668-2
IS - 2184-2841
AU - Zaikin, D.
PY - 2023
SP - 92
EP - 96
DO - 10.5220/0012096500003546
PB - SciTePress