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Authors: Tanaporn Leelawattananon 1 ; Kritsakorn Lorchalearnrat 1 and Suphamit Chittayasothorn 2

Affiliations: 1 Faculty of Science and King Mongkut’s Institute of Technology Ladkrabang, Thailand ; 2 Faculty of Engineering and King Mongkut’s Institute of Technology Ladkrabang, Thailand

Keyword(s): Surface Plasmon Wave, Kretschmann Configuration, Finite Element Method, Simulation.

Related Ontology Subjects/Areas/Topics: Application Domains ; Computer Simulation Techniques ; Simulation and Modeling ; Simulation Tools and Platforms ; Telecommunication Systems and Networks

Abstract: This paper presents computer simulation of optical activations based on the Kretschmann configuration using a prism for the observation of the surface plasmon wave. This is according to the condition of the dispersion relation. The analysis of the electric field of the surface plasmon wave which appears at the interface between the metal layer and the air layer is done by using the Finite Element Method (FEM). The simulation is performed using the COMSOL Multiphysics software which supports the FEM. The objective of our experiment is to find the most suitable thickness of the metal thin film which is most suitable for the surface plasmon excitation when activated by 632.5 nm red laser light source. The red laser light source is commonly available and also very economical. The metal used in our work is copper which is an economical noble metal and gives better conductivity than gold. The findings from the simulation will be used in the future high precision physical experiments. The o utcome of this research project, the surface plasmon wave on copper thin film, is expected to be used in bio-molecular detectors or high speed THz communications. (More)

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Paper citation in several formats:
Leelawattananon, T.; Lorchalearnrat, K. and Chittayasothorn, S. (2017). Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method. In Proceedings of the 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - SIMULTECH; ISBN 978-989-758-265-3; ISSN 2184-2841, SciTePress, pages 188-195. DOI: 10.5220/0006395601880195

@conference{simultech17,
author={Tanaporn Leelawattananon. and Kritsakorn Lorchalearnrat. and Suphamit Chittayasothorn.},
title={Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method},
booktitle={Proceedings of the 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - SIMULTECH},
year={2017},
pages={188-195},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0006395601880195},
isbn={978-989-758-265-3},
issn={2184-2841},
}

TY - CONF

JO - Proceedings of the 7th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - SIMULTECH
TI - Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method
SN - 978-989-758-265-3
IS - 2184-2841
AU - Leelawattananon, T.
AU - Lorchalearnrat, K.
AU - Chittayasothorn, S.
PY - 2017
SP - 188
EP - 195
DO - 10.5220/0006395601880195
PB - SciTePress

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