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Authors: David N. Ku and Jin Wu Fan

Affiliation: Georgia Institute of Technology, United States

Keyword(s): Biomaterial, mechanics, elasticity, strength, wear, biocompatibility, medical devices.

Related Ontology Subjects/Areas/Topics: Biomaterials ; Biomedical Engineering ; Biomedical Instruments and Devices

Abstract: Typical biomaterials are stiff, difficult to manufacture, and not initially developed for medical implants. A new biomaterial is proposed that is similar to human soft tissue. The biomaterial provides mechanical properties similar to soft tissue in its mechanical and physical properties. Characterization is performed for modulus of elasticity, ultimate strength and wear resistance. The material further exhibits excellent biocompatibility with little toxicity and low inflammation. The material can be molded into a variety of anatomic shapes for use as a cartilage replacement, heart valve, and reconstructive implant for trauma victims. The biomaterial may be suitable for several biodevices of the future aimed at soft-tissue replacements.

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Paper citation in several formats:
N. Ku, D. and Wu Fan, J. (2008). BIOMATERIAL FOR SOFT TISSUE REPLACEMENTS. In Proceedings of the First International Conference on Biomedical Electronics and Devices (BIOSTEC 2008) - Volume 1: BIODEVICES; ISBN 978-989-8111- 17-3; ISSN 2184-4305, SciTePress, pages 23-29. DOI: 10.5220/0001048500230029

@conference{biodevices08,
author={David {N. Ku}. and Jin {Wu Fan}.},
title={BIOMATERIAL FOR SOFT TISSUE REPLACEMENTS},
booktitle={Proceedings of the First International Conference on Biomedical Electronics and Devices (BIOSTEC 2008) - Volume 1: BIODEVICES},
year={2008},
pages={23-29},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0001048500230029},
isbn={978-989-8111- 17-3},
issn={2184-4305},
}

TY - CONF

JO - Proceedings of the First International Conference on Biomedical Electronics and Devices (BIOSTEC 2008) - Volume 1: BIODEVICES
TI - BIOMATERIAL FOR SOFT TISSUE REPLACEMENTS
SN - 978-989-8111- 17-3
IS - 2184-4305
AU - N. Ku, D.
AU - Wu Fan, J.
PY - 2008
SP - 23
EP - 29
DO - 10.5220/0001048500230029
PB - SciTePress