effect transistor exhibits the higher current change as
the same gate voltage applied (Yeo et al., 2000). In
the previous works (Change et al., 2008a), it has
already demonstrated IgG antibody sensing
capability of SiGe nanowire sensor. First, the 3-
amino-propyltrime-thoxy-silane (APTS) was used to
modify the surface, which can connect the bio-linker.
APTS is used to modify the surface of native oxide
layer around nanowires. Hydroxyl functional groups
on the surface of native oxide layer were replaced by
the methoxy groups of APTS molecules. After
APTS modification, the surface of nanowire was
terminated by amine groups. In the experimental
environment, amine group is prone to be positively
charged, that is, the surface potential nanowire
increased, and the conductance of p-type nanowire
decreased. Next, bis-sulfo-succinimidyl suberate
(BS3) is used as linker between APTS and IgG
antibody. BS3 treatment resulted in negative charges.
Hence, the conductance of p-type nanowires
increased. After APTS and BS3 modification,
nanowire was capable of capturing IgG antibody.
Instead of the convention silicon nanowire, SiGe
nanowire sensor is expected to have better
sensitivity in the chemical detection for higher
carrier mobility as the same bio-molecular bind on
the surface. It is well known that annealing
temperature did repair the interior defects of SiGe.
The higher concentration of Ge the higher sensitivity
would become. However, excess of Ge will induce
more vacancies of surface, which will degrade the
adhesion between APTS and interface and decrease
sensitivity (Change et al., 2008b).
In this paper, we used the sidewall spacer
technique to fabricate the Si
0.93
Ge
0.07
and Si
0.86
Ge
0.14
nanowires with different annealing temperature for
discussion of the sensitivity, respectively. We focus
on investigating the change of conductance (ΔG) and
sensitivity (S) of different samples corresponding to
APTS treatment.
2 EXPERIMENT
The structure is shown in Figure 1. All test samples
were fabricated on p-type (100)-oriented bare silicon
wafer with 1~10 Ω-cm resistivity. The poly-Si,
Si
0.93
Ge
0.07
and Si
0.86
Ge
0.14
nanowires were
fabricated by the side-wall spacer technique using
the combination of the conventional lithography and
processes technology, respectively. Starting with
standard RCA clean of silicon substrate, wet
oxidation was performed by SVCS Furnace system
at 980℃ for 7 hours to grow the bottom oxide of
about 5500 Å as an insulator oxide. After
lithography patterning of active area, oxide was
etched by Tokyo Electron Limited TE5000 Reactive
Ion Etch (RIE) system to form a 3000 Å oxide step.
Then, standard RCA clean was performed, followed
by a amorphous silicon (α-Si) film of 200 Å
deposition by SVCS Furnace system at 650℃ as
seed layer for SiGe film deposition. Then, a
polycrystalline SiGe film of 600 Å was deposited by
the ultra-high-vacuum chemical vapor deposition
(ANELAVA SiGe UHV-CVD) at 665℃. After
lithography patterning of the Source/Drain (S/D)
contact region, the SiGe film (800 Å, 20% over
etched) was etched by Transformer Coupled Plasma
(TCP) poly etcher. Only the S/D contact region and
the side-wall spacer retained SiGe. The residue SiGe
film is called SiGe nanowire. After lithography
patterning of removal of unwanted sidewall spacer,
the SiGe nanowire were etched and isolated. Finally,
Boron was heavily doped with 5×10
15
atoms/cm
2
at
10 keV to form p-type SiGe nanowire. Next, the
samples were subject to activation annealing in
nitrogen (N
2
) ambient at 800, 900, 950 and 1000 ℃
for 30 minutes. The aluminum was deposited by
thermal coater and patterned to reserve the S/D
region and sintered at 400
o
C for 30 minutes.
The Hewlett Packard HP 4156A was used in this
study to measure the electric characteristics of
nanowire sensor. Drain voltage (V
D
) was varied
from -10 to 10V and 500 mV a step, and back gate
voltage was 0 V. The measurement of electric
characteristics was performed ate every stage of
surface modification, and the average conductance
was then extracted from I
D
-V
D
characteristics with
V
D
= 3~6 V.
Figure 1: Schematic representation of SiGe nanowire
structure by the side-wall spacer technique.
3 RESULTS AND DISCUSSIONS
The sensitivity (S) of a nanowire-based sensor is
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