“Dynamic Right-Sizing for Power-Proportional Data
Centers,” Proc. IEEE INFOCOM, 2011.
J. Luo, L.Rao, and X. L. Liu, “Data center energy cost
minimization: a spatio-temporal scheduling approach,”
in Proceedings of the INFOCOM 2013.
P. Chaparro, et al., “Understanding the Thermal
Implications of Multicore Architectures,” IEEE
Transactions on Parallel and Distributed Systems, vol.
18, no. 8, pp. 1055-1065, August 2007.
M. Ma, S. Gunther, B. Greiner, N. Wolff, C. Deutschle,
and Tawfik Arabi, “Enhanced Thermal Management
for Future Processors,” IEEE Symposium on VLSI
Circuits of Technical Papers, pp. 201-204, June 2003.
J. Tschanz, S. Narendra, Y. Ye, B. Bloechel, S. Borkar,
and V. De, “Dynamic Sleep Transistor and Body Bias
for Active Leakage Power Control of
Microprocessors,” IEEE Journal of Solid-State
Circuits, vol. 38, no. 11, pp. 1838-1845, November
2003.
D. Brooks, V. Tiwari, and M. Martonosi, “Wattch: A
framework for architectural-level power analysis and
optimizations,” In International Symposium on
Computer Architecture, June 2000.
T. Sato and T. Funaki, “Power-Performance Trade-off of a
Dependable Multicore Processor,” in 13
th
Pacific Rim
International Symposium on Dependable Computing
(PRDC), 2007.
R. Ghosh, V. K. Naik, and K. S. Trivedi, “Power-
Performance Trade-offs in Iaas Cloud: A Scalable
Analytic Approach,” in IEEE/IFIP DSN Workshop on
Dependablity of Clouds, Data Centers and Virtual
Computing Environments (DCDV), 2011.
E. Pinheiro, R. Bianchini, E. V. Carrera, and T. Heath,
“Load balancing and unbalancing for power and
performance in cluser-based systems,” Workshop on
Compiliers and Operating Systems for Low Power,
2001.
J. Chase, D. Anderson, P. Thakur, and A. Vahdat,
“Managing Energy and Server Resources in Hosting
Centers,” Proceedings of the 18
th
Symposium on
Operating systems Principles SOSP’01, Octorber
2001.
Y. Chen, A. Das, W. Qin, A. Sivasubramaniam, J. Srebric, Q.
Wang, and J. Lee, “Managing Server Energy and
Operational Costs in Hosting Centers,” SIGMETRICS
Performance Evaluation Review, vol. 33, no. 1, pp. 303-314,
2005.
F. Ahmad and T. Vijaykumar, “Joint optimization of idle and
coolingpower in data centers while maintaining response
time,” Architectural Support for Programming Languages
and Operating Systems, 2010.
B Müller-Clostermann, “Using G/G/m-Models for Multi-Server
and Mainframe Capacity Planning,” ICB Research Report,
no. 16, May 2007.
R. McGowen, C. A. Poirier, C. Bostak, J. Igonowski, M.
Millican, W. H. Parks, and S. Naffziger, “Power and
temperature control on a 90-nm Itanium family processor,”
IEEE Journal of Solid-State Circuits, vol. 41., no 1, pp. 228-
236, January 2006.
T. D. Burd, T. A. Pering, A. J. Stratakos, and R. W. Brodersen,
“A Dynamic Voltage Scaled Microprocessor System,” IEEE
Journal of Solid-State Circuits, vol. 35, no. 11, pp. 1571-
1580, November 2000.
K. J. Nowka, G. D. Carpenter, E. W. MacDonald, H. C. Ngo, B.
C. Brock, K. I. Ishii, T. Y. Nguyen, and J. L. Burns, “A 32-bit
PowerPC System-on-a-Chip With Support for Dynamic
Voltage Scaling and Dynamic Frequency Scaling,” IEEE
Journal of Solid-State Circuits, vol. 37, no. 11, November
2002.
S. Heo, K. Barr, and K. Asanovic, “Reducing power
density through activity migration,” International
Symposium on Low Power Electronics and Design,
Aug. 2003.
K. Zhang et al., “SRAM design on 65-nm CMOS
technology with dynamic sleep transistor for leakage
reduction,” IEEE Journal of Solid-State Circuits, vol.
40, no. 4, April 2005, pp. 895-901.
S. Henzler, T. Nirschl, S. Skiathitis, J. Berthold, J. Fischer,
P. Teichmann, F. Bauer, G. Georgakos, and D.
Schimitt-Landsiedel, “Sleep transistor circuits for fine-
grained power switch-off with short power-down
times,” in Proc. Int. Sold-State Circuits Conf., 2005,
pp. 302-303.
D. Copeland, “64-bit Server Cooling Requirements,”
IEEE SEMI-THERM Symposium, 2005.
R. Mahajan, C. P. Chiu, and G. Ghrysler, “Cooling a
Microprocessor Chip,” in Proceedings of the IEEE,
vol. 94, no. 8, Aug. 2006.
A. G. Agwu Nnanna, “Application of refrigeration system
in electronics cooling,” Applied Thermal Engineering,
vol. 26, pp. 18-27, 2006.
R. C. Chu, R. E. Simons, M. J. Ellsworth, R. R. Schimidt,
and V. Cozzolino, “Review of Cooling Technologies
for Computer Products,” IEEE Trans. on Device and
Material Reliability, vol. 4, no. 4, pp. 568-585, Dec.
2004.
P. E. Phelan, V. A. Chiriac, and T. T. Lee, “Current and
Future Miniature Cooling Technologies for High
Power Microelectronics,” IEEE Trans. on Components
and Packaging Technologies, vol. 25, no. 3, pp. 356-
365, Sep. 2002.
S. Trutassanawin, E. Groll, V. Garimella, and L.
Cremaschi, “Experimental Investigation of a
Miniature-Scale Refrigeration System for Electronics
Cooling,” IEEE Trans. on Components and Packaging
Technologies, vol. 29, no. 3, pp. 678-687, Sep. 2006.
D. M. Carson, D. C. Sullivan, R. E. Bach, and D. R.
Resnick, “The ETA-10 liquit-nitrogen-cooled
supercomputer sytem,” IEEE Trans. Electron.
Devices, vol. 36, no. 8, pp. 1404-1413, Aug. 1989.
Won Ho Park, Tamer Ali, and C.K. Ken Yang, “Analysis
of Refrigeration Requirements of Digital Processors in
Sub-ambient Temperatures,” Journal of
Microelectronics and Electronic Packaging, vol. 7,
no. 4, 4
th
Qtr 2010.
Won Ho Park and C.K. Ken Yang, “Effects of Using
Advanced Cooling Systems on the Overall Power
Consumption of Processors,” accepted for IEEE
EffectsofActiveCoolingonWorkloadManagementinHighPerformanceProcessors
15