Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting

Yoshiharu Nakamura, Shuichi Enokida

2016

Abstract

It is especially needed for the IC lead frames used in the manufacture of semiconductors, which require both high quality and miniaturization. To overcome above, automatic defect detection systems based on image processing methods were proposed. Especially, this paper focuses on methods using the surface normal direction to detect a deformation in flat parts. Since most of these methods use a fixed parameter, the risk of missing a defect in industrial parts becomes a problem. In this paper, new defect detection method is proposed for detecting various defect sizes and defect types. This method determines the appropriate block size based on the median value of luminance dispersions calculated for several block sizes and learning from a sample that detects a defect point beforehand. We used 105 samples in our experiments. Our experimental results show our proposed method selects the superior parameters and identification of the defect area selected is superior with learning in detecting defects of several sizes.

References

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Paper Citation


in Harvard Style

Nakamura Y. and Enokida S. (2016). Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting . In Proceedings of the 11th Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications - Volume 4: VISAPP, (VISIGRAPP 2016) ISBN 978-989-758-175-5, pages 117-125. DOI: 10.5220/0005675801170125


in Bibtex Style

@conference{visapp16,
author={Yoshiharu Nakamura and Shuichi Enokida},
title={Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting},
booktitle={Proceedings of the 11th Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications - Volume 4: VISAPP, (VISIGRAPP 2016)},
year={2016},
pages={117-125},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0005675801170125},
isbn={978-989-758-175-5},
}


in EndNote Style

TY - CONF
JO - Proceedings of the 11th Joint Conference on Computer Vision, Imaging and Computer Graphics Theory and Applications - Volume 4: VISAPP, (VISIGRAPP 2016)
TI - Development of Defect Verification System of IC Lead Frame Surface using a Ring-lighting
SN - 978-989-758-175-5
AU - Nakamura Y.
AU - Enokida S.
PY - 2016
SP - 117
EP - 125
DO - 10.5220/0005675801170125