also called pitch- of 2 µm and a vertical periodicity
about 2.5 µm. This vertical periodicity is limited to
the lattice parameter: when approaching to the pitch
value, the vertical periodicity is more difficult to
achieve and the profile is much more difficult to
control by EE. Although some other studies reported
modulated structures in 700 nm (Langner 2008),
they did not insert a cavity in their structures,
probably because the profiles were not as good as
the ones obtained in 2 µm of pitch. In the present
study, the samples used to fabricate the macroporous
silicon PCs had a pitch of 700 nm and a vertical
periodicity around the lattice parameter, what
enabled us to place a peak and tailor it at wavelength
as short as 4.6 microns, were different gas
absorption peaks can be found.
By removing around 160 µm of bulk silicon of the
samples, we have been able to increase the
transmission percentage from values around 4%-6%
up to values between 25% and 30%. This improves
the features of the peak –i.e. transmittance and
quality factor- and, as a consequence, the sensitivity
of the final gas sensor device is enhanced. Further
improvement of the transmission could be achieved
by removing some more bulk silicon, but the risk of
damaging the photonic crystal –mechanical support
or etching of the PC structure- becomes high and
some silicon bulk has to be left to avoid these
problems. In the case of thermal emission this layer
has not an important impact in the relative
transmission amplitude of the peak –from the base to
the top of the resonant peak-, but it has a
considerable effect in the position of the base point.
Specifically, the more bulk silicon the more
radiation of the no texturized region, which is finally
reflected in a higher offset from the zero emission
point to the base point, where the emission peak
rises.
The conclusions drawn in this paper lead us to
confirm that the studied macroporous silicon
structures can be employed in gas sensing
applications. However, further work has to be done
in order to improve the amplitude and the Q-factor
of the peak, as well as to reduce the offset, either
working in transmission or emission.
2 EXPERIMENTAL
The 3D structures were obtained by electrochemical
etching of n-type (100) crystalline silicon samples in
hydrofluoric (HF) acid solution. The starting
material had a resistivity between 0.1-0.3 Ω·cm
(~3·10
16
/cm
3
phosporous-doped). An N
+
layer was
implanted on the backside of the wafer to provide a
low-resistance transparent ohmic contact. Next, the
wafer was oxidized and a nanoimprint lithography of
700 nm pitch was performed. A Reactive-ion
Etching (RIE) and a tetramethylammonium
hydroxide (TMAH) etching were done to create
inverted pyramid-shaped pits that act as nucleation
centres for the ordered pore growth. Finally, the EE
etching was carried out to control the modulation of
pore diameter which, is regulated by the applied
etching current. This method allows to design the
profile beforehand and to create smooth 3D
structures of great complexity just by applying
different etching currents.
In particular, the periodical profiles attached in
Fig.1 have been generated. In the first sample (left)
the depth periodicity was set to be about 1.1-1.2 µm
what arouse a bandgap around [5-7] µm. As
depicted in the figure, a planar defect was introduced
halfway the total pore depth by suppressing one of
the modulations and leaving a constant diameter
section. The length of the cavity varied from 2.1 µm
to 2.6 µm with a diameter of 0.23 µm in all the
samples. In order to reduce the bandgap central
wavelength, and thus the position of the peak, the
vertical modulation of the pore was shortened. In
concrete, it was set to the lattice constant value
(~700nm). Thanks to that, the bandgap moved to the
range of [4-5] µm, while the defect’s length took
values in the range of [1.5-1.8] µm. The total depth
of all samples was about 12-15 micrometers. A
complete description of the process can be found
elsewhere (Lehmann 1993). The second fabricated
structure can be observed in the right image.
Figure 1: Cross sectional view of two 3-D PCs fabricated
by EE over a litography of 0.7 μm pitch. The inclusion of
a defect in the PC lattice enables a transmitted mode in 6.4
µm (left) and 4.6 µm (right). (les he reordenat en l’ordre
del text).