12
0
2
2211
1
(()/ )
2
22
11
exp
22
exp 1 exp 1
22 22
dMRISIMS
zwz zwz
Iz I erf erf
zw
ww
z zwz z zwz
erf erf
ww
ww
σσ
σ
σσ
σσ
−−
⎡⎤
+− +−
⎛⎞⎛⎞
=−
⎢⎥
⎜⎟⎜⎟
⎝⎠⎝⎠
⎣⎦
⎡⎤
+
⎛⎞
+−+
⎢⎥
⎜⎟
⎝⎠
⎢⎥
⎣⎦
⎧ ⎫
⎡⎤⎡⎤
+− +−
⎛⎞ ⎛⎞
⎪ ⎪
⎛⎞ ⎛⎞
×+ −−+ −
⎨ ⎬
⎜⎟ ⎜⎟
⎢⎥⎢⎥
⎜⎟ ⎜⎟
⎝⎠ ⎝⎠
⎝⎠ ⎝⎠
⎪ ⎪
⎣⎦⎣⎦
⎩ ⎭
(9)
In SIMS, the simple analytical solution of the ideal delta layer is usually applied for monolayers.
In reality, however, the thinnest layer is an atomic monolayer, with a thickness of 0.25 ± 0.05 nm in
most semiconductors and metals. If we assume a DRF of lower limit, for example for the case of
SIMS (Eq. (9)) with σ = w = 1 ML, the resulting FWHM (full width at half maximum) of the profile
for z
2
- z
1
= 0 is about 2.9 monolayers or ca.0.8 nm for a delta layer [8]. It shows that the FWHM of
the measured profile after Eq. (9) increases slightly with increasing layer thickness until it becomes
identical to the latter for a thickness above 8 monolayers [8]. For higher values of the DRF
parameters the deviation between an ideal delta layer and a monolayer is reduced.
In summary, analytical DRFs can be applied to the convolution integral of (1) Delta layers, (2)
Layers with any finite thickness and constant analyte concentration, (3) Multilayers of type 2). [8]
The main advantage of the analytical solution of the DRF is that the application of it is simple and
user friendly because no computer programming is necessary for graphical representation. It is
particularly useful for quantifying measured delta layer depth profiles in AES and SIMS [11]. This
paper will demonstrate that the layer thickness and the depth resolution values could be obtained by
fitting the measured SIMS depth profiles of a multilayer (a quantum-well structure) and a thick layer
respectively by applying the analytical solution of the convolution integral. It is customary to assume
X(z) and to calculate the intensity I(z)/I
0
in a “forward” manner with a known depth resolution
function g(z), and compare it with the measured I/I
0
(z). This procedure is performed repeatedly by
trial and error until an optimum fit of both is obtained. This is done by a computational program that
varies the X(z) distribution until the minimal value of the average deviation of the calculated from
the measured profiles is achieved. The final input X(z) is the reconstructed, original in-depth
distribution of composition.
3. Results and discussion
To demonstrate the application of the analytical MRI model, the measured SIMS depth profiles of
Si
0.73
Ge
0.27
superficial layer and Si
0.4
Ge
0.6
/Ge 10-period quantum well (QW) on Si substrate [2, 12]
will be quantified. Both layer structures were deposited on Si substrate by chemical vapor deposition
(CVD). The Si
1−x
Ge
x
superficial layer thickness is determined as 26.6 ± 0.5nm [2]. The Si
0.4
Ge
0.6
/Ge
10-period QW thickness values determined from HR-XTEM picture are listed in Table 1 [12]. The
SIMS profiling was performed with an Atomika 4500 instrument using primary ions of O
2
+
with a
range of energies (0.25–1keV) at near normal incidence. An area of 220x220 mm was scanned, and
the 30Si
+
and 70Ge
+
secondary ions were recorded.
Table 1. Si
0.4
Ge
0.6
/Ge QW thickness values determined by XTEM [12].
Figure 2 shows the measured and normalized Ge SIMS depth profiles as open circles for
Si
0.73
Ge
0.27
superficial layer on Si substrate using different O
2
+
beam energies from 0.4-2.0 keV. The
best fits for each measured depth profile using Eq. (9) are shown as solid lines in Figure 2. The
Period number 1 2 3 4 5 6 7 8 9 10
Si0.4Ge0.6 layer (nm) 8.6 8.6 8.6 8.5 8.5 8.5 8.4 8.5 8.4 8.6
Ge layer (nm) 12.6 12.7 12.6 12.6 12.7 12.7 12.7 12.7 13.0 12.8