degradation rate of chitosan-roselle films determined
by DTG were lower when increased the roselle ratio
in the blend films at cure temperature of 50, 60 and
70
o
C. Thus, the chitosan-roselle films were degrade
faster when increased the roselle ratio in blend film
at ambient temperature. From the cure temperature
50, 60 and 70
o
C, the most optimum cure temperature
was 60
o
C which showed the lowest weight loss and
exhibited the highest heat resistance compared to
other cure temperature. SEM results showed the
surface structure of different ratio of chitosan-roselle
films which were cure at 60◦C. The higher ratio of
chitosan-roselle, the surface structure become
smoother. As conclusion, chitosan-roselle films have
higher heat resistance, degraded faster and have
smoother surface at most optimum cure temperature
(60
o
C). The smoother surface of chitosan-roselle
films made the higher thermal resistance of these
blend films.
ACKNOWLEDGEMENTS
This work was supported by Faculty of Mathematic
and Natural Sciences, Universitas Sumatera Utara
and School of Materials Engineering, Universiti
Malaysia Perlis.
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