Figure 11: Crosstalk analysis models for the (a) uniform
cube-core and (b) nonuniform cuboid-core structures.
Figure 12: Crosstalk dependence on propagation distance.
4 CONCLUSIONS
For a Pbit/s-class chip-to-chip interconnection with a
multilayer optical waveguide, cuboid-core structures
for vertical light beam propagation were studied.
To solve the problem of poor optical coupling
between the optical devices and waveguide in the
lower layer, a cube-core structure was previously
reported for improving the optical confinement of
the vertical light beam propagation in a multilayer
multimode waveguide. In this study, it was applied
to the design of a multilayer single-mode waveguide
for 1.31-μm light. In the simulation, the structure
drastically improved the coupling efficiency;
however, it could only provide a coupling efficiency
of −8.2 dB for a 10-layer structure.
To further improve the coupling efficiency, a
nonuniform square-base cuboid-core structure was
proposed. The base size of the cuboid gradually
changed along with the light beam propagation. The
new design showed a coupling efficiency of −4.4 dB
for a 10-layer structure and provided a crosstalk of
−20.6 dB, which is 2.5 dB less than that of the
uniform structure.
These simulated results show that using the
proposed nonuniform cuboid-core structure, a 10-
layer single-mode polymer waveguide structure for
chip-to-chip optical interconnection with a huge
transmission capacity can be realized.
ACKNOWLEDGEMENTS
The authors would like to thank Prof. Takahiro
Watanabe for his valuable suggestions.
REFERENCES
Calo, S., Touna, M., Verma, D., Cullen, A., 2017. Edge
computing architecture for applying AI to IoT. 2017
Proc. of IEEE Int’l Conference on Big Data, 3012-
3016.
Atlam, H., Walters, R., Wills, G., 2018. Intelligence of
Things: Opportunities & Challenges. 2018. Proc. of
3rd Cloudification of the Internet of Things, 1-6.
Matsuoka, Y., Adachi, K., Lee, Y., Ido, T., 2012. A 25-
Gbit/s high-speed optical-electrical printed circuit
board for chip-to-chip optical interconnections. Proc.
of 2nd IEEE CPMT Symposium Japan, 1-4.
Shishikura, M., Matsuoka, Y., Ban, T., Shibata, T.,
Takahashi, A., 2007. A High-Coupling-Efficiency
Multilayer Optical Printed Wiring Board with a Cube-
Core Structure for High-Density Optical
Interconnections. Proc. of 57th Electronic
Components and Technology Conference, 1275-1280.
Suzuki, K., Ishigure, T., 2015. Fabrication for high-density
multilayered GI circular core polymer parallel optical
waveguide. Proc. of IEEE Optical Interconnects
Conference, TuP13, 86-87.
Ishii, H., Tanaka, N., Sakamoto, T., Takahara, H., 2003.
Fully SMT-compatible optical-I/O package with
microlens array interface. IEEE J. Lightwave Technol.,
21(1), 275-280.
Doany, F., Schow, C., Lee, B., Budd, R., Barks, C., Tsang,
C., Knickerbocker, J., Dangel, R., Chan, B., Lin, H.,
Carver, C., Huang, J., Berry, J., Bajkowski, D.,
Libsch, F., Kash, J., 2012. Terabit/s-Class Optical
PCB Links Incorporating 360-Gb/s Bidirectional 850
nm Parallel Optical Transceivers. IEEE J. Lightwave
Technol., 30(4), 560-571.
Vyrsokinos, K., Moralis-Pegios, M., Vagionas, C.,
Brimont, A., Zanzi, A., Sanchis P., Marti, J., Kraft, J.,
Rohracher, K., Dorrestein, S., Bogdan, M., Pleros, N.,
2016. Single Mode Optical Interconnects for Future
Data Centers. Proc. of 18th Int’l Conference on
Transparent Optical Networks (ICTON), Mo.C3.1.