sessed through the noise density variation analysis.
Thereby, the glue level estimation accuracy is eval-
uated regarding different noise densities. In Figure
9 the regression models are applied in two different
noises, Salt and Pepper and Gaussian noises, regard-
ing three noise densities, 0.001, 0.005 and 0.01. In
Figures 9a and 9b the RMSE behaviors are presented
regarding the Salt and Pepper and Gaussian noises,
respectively. From Figures 9a and 9b it is possible
to verify the proposed approach effectiveness, even in
different noise densities.
5 CONCLUSION
In this paper, we addressed the problem of automatic
visual inspection for glue level control. Unlike other
state-of-the-art approaches, our method continuously
monitors the glue level during the glue injection pro-
cess in PCB manufacturing, aggregating more infor-
mation to production process.
Real-world and simulated experiments involving
different regression models and simulated noise types
have shown that the obtained glue level predictions
are reliable and accurate considering the obtained re-
sults. Additionally, the proposed approach demon-
strates robustness, even in presence of noise during
image acquisition, and feasibility to real time indus-
trial application, once the experiments were carried
out in real time scenario.
As future work, we intend to combine different
predictive methods to improve the glue level estima-
tion accuracy. We also intend to concentrate efforts
to extend the automatic visual inspection approach to
tackle other types of problems related to PCB manu-
facturing. The volume and position control of injected
glue is also a relevant problem we intend to investi-
gate and incorporate in production lines.
ACKNOWLEDGMENT
This work was developed with support from Cal-
Comp Eletronic through R&D project in Institute of
Exact Sciences and Technology of Federal University
of Amazonas, Itacoatiara, Amazonas.
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