of the cell, relaxation of spin polarization due to
collision of this atom with the inner wall of the cell
can be suppressed by coating the inner wall of the
cell. This coating is called a spin relaxation
preventing coating, and paraffin (CH
3
(C
n
H
2n
) CH
3
:
n> 20) has been widely used so far. The effect of
prevention of spin relaxation by paraffin coating was
first demonstrated by Robinson et al. in 1958
(Robinson et al., 1958). With no relaxation of spin
polarization maximum of about 10,000, it is possible
to collide with the inner wall, and it is expected to be
applied to the field of ultrahigh sensitivity magnetic
sensors and quantum communication. The well-
known paraffin coating on the inner wall surface of
the cell can be said to be an extremely useful means
for obtaining a long spin relaxation time, but the
physical action of its spin relaxation prevention effect
is not well understood at present. According to
Bouchiat et al. (Bouchiat et al., 1966), dipole-dipole
interaction between electron spin of spin-polarized
atom and nuclear spin of coated surface hydrogen
atom, or orbital angular momentum and electron spin
of relative motion between coating surface atoms and
spin-polarized atoms Interaction is said to be the
cause of spin relaxation. However, the result of this
research alone is insufficient to understand the
workings of the coating. For example, an effect of
preventing spin relaxation at a high temperature is
dulled, annealing at 80 °C for several hours in the
presence of alkaline vapor called "aging process"
after coating of paraffin increases spin relaxation
prevention effect (Seltzer et al., 2010), but neither has
been fully understood. Spin relaxation prevention
effect obtained by the same coating material and the
same manufacturing method is greatly different, and
it falls within the skill of coating applicants and
researchers.
One of authors has independently developed an
atomic layer deposition method and an atomic layer
deposition method of oxide by sequential surface
chemical reaction using organometallic gas and water
vapor as a starting material, so that an alkyl group (n
= 1, 2, 3). We found that precise film thickness
control can be realized using "self-limiting
mechanism" appearing in the adsorption process, and
in particular, we have found that it is possible to
realize precise film thickness control using "self-
limiting mechanism", to overcome the extremely
difficult task of making a multilayer film structure
(Kumagai et al., 1997).
2 EXPERIMENTAL SETUP
The experimental setup was comprised of a stainless
steel vacuum chamber with two computer-controlled
leak valves, a capacitor manometer, turbo-molecular
pump (TMP) and quartz crystal unit to allow in situ
measurements during growth of metal oxides. As a
substrate, (100)-oriented Si wafers were used together
with quartz glass cells. The substrate was first
ultrasonically cleaned in conventional organic
solvents, then dipped in 4.7% HF to remove the native
oxide. After rinsing it in overflowing deionized water,
it was loaded into a vacuum chamber. As vapor
sources for the aluminum oxide film, two precursors
were used in Fig.1. high-purity trimethyl-aluminum
(TMA) and ethanol (EtOH) were used as precursor A
and B, respectively.
Figure 1: Atomic layer deposition utilizing two distinct
precursors (A, B) sequentially dosed to the substrate
producing a chemical reaction.
EtOH was prepared by Ethanol JIS special grade,
≥99.5%.These vapors were introduced alternately by
two computer-controlled leak valves into the chamber
which was evacuated by a TMP to a pressure below
10
-7
Torr. Figure 2 shows input signals applied to the
computer-controlled leak valves for generating each
vapor pulse whose peak vapor pressure reached 1x10
-
4
Torr. The duration of supplying each vapor pulse
was 30 s, while the chamber was continuously
exhausted during the growth. The time point exactly
20 s before the first dosing of TMA vapor was defined
as t= 0 s. Therefore, TMA vapor was first introduced
at t = 20 s during the supplying time, and then at t=
110 s, EtOH vapor was first introduced, and then at
t= 200 s, TMA vapor was introduced again. From t =
290 s onwards, these binary vapors were supplied
alternately according to the sequence in Fig. 2.
Atomic layer deposition at room temperature was
carried out by changing the combination of
trimethylaluminum (TMA) and water vapor (H
2
O)
which was often used in the atomic layer deposition
method, in addition to H
2
O as ethanol as an oxidizing