A Low-Cost Printed Circuit Board Design for External Force Measuring

in Robotic Applications

H. Meneses

, V. Jarquin,

, Y. Miranda

, C. Cordero

N. Delgado

, K. Vargas

and F. Ru

ız

Instituto de Investigaciones en Ingenier

ıa, Facultad de Ingenier

ıa,

Universidad de Costa Rica, 11501-2060, San Jos

e, Costa Rica

{helber.meneses, valeria.jarquin, yehohnathan.miranda, carlos.corderoretana,

Keywords:

Force Sensing, Impedance Control, Printed Circuit Board, Strain Gauge, Wheatstone Bridge.

Abstract:

This paper presents a low-cost printed circuit board designed to measure external forces in several robotics

applications. Its operating principle is based on capturing electrical resistance change coming from strain

gauges attached to deformable beams in elastic force-torque sensors. This system offers great ﬂexibility

because users can adjust up to 8 Wheatstone bridge circuit in different conﬁgurations depending on their

needs, their parameters as offset and ampliﬁcation gain can easily be conﬁgured and the assembly process is

intended to be fast using a pick-and-place machine and a soldering oven.

1 INTRODUCTION

In the last decade the interest to bring out robots or

autonomous systems form factories has risen due to

their capacity to develop repetitive tasks (Prabakaran

et al., 2018), to execute dangerous jobs made in haz-

ardous environments (Wong et al., 2018) or to support

elderly people in daily activities (Oda et al., 2010).

The main limitations to achieve this goal are based

on their economic cost and their capacities to be

safe for the objects and people in the environment

(Kim et al., 2016). Some works have dealt with

the last issue incorporating force control approaches

as the well known impedance or admittance con-

trol (Calanca et al., 2016) based on force-torque sen-

sors located in particular robot joints (Dietrich et al.,

2016; Kim et al., 2016; Kim et al., 2014; Bussmann

et al., 2018; Iskandar et al., 2019; Sentis et al., 2013;

Nozawa et al., 2011), wrapping the robot in a kind

of skin made up of a large number of pressure sen-

sors (Armleder et al., 2022; Cheng et al., 2019; Dean

et al., 2019; Mittendorfer, 2012) or attaching a 6 de-

https://orcid.org/0000-0001-7119-3100

https://orcid.org/0009-0007-2339-3678

https://orcid.org/0009-0001-5842-0097

https://orcid.org/0009-0007-9435-7922

https://orcid.org/0009-0006-4099-8671

https://orcid.org/0009-0009-1958-7554

https://orcid.org/0000-0001-8563-4341

gree of freedom (DoF) force-torque sensor to a rigid

robot shell in one point (Kollmitz et al., 2018) or to a

rigid body part (Fr

emy et al., 2014; Oda et al., 2010;

Aguirre-Ollinger and Yu, 2021).

In literature, one of the preferred technologies to

build force-torque sensors is based on strain gauges

that capture the mechanical deformation of elastic

material. For instance, the works presented by (Chen

et al., 2015; Yuan et al., 2015; Valizadeh et al., 2015;

Lin et al., 2019; Sun et al., 2013; Phan et al., 2018;

Kebede et al., 2019) analysed the design and im-

plementation of force-torque sensor with up to eight

Wheatstone bridge in quarter, half, full bridge conﬁg-

urations or a mix of them.

The main reasons to employ this piezo-resistive

sensor has attractive qualities, namely, high measure-

ment accuracy and it is suitable for static or quasi-

static measurements (Chen et al., 2015), and temper-

ature compensation is possibly achieved using Wheat-

stone bridge circuits (Templeman et al., 2020).

Until now, it is of our knowledge in literature, that

there is not a complete low-cost printer circuit board

design that shows the whole conﬁguration to sense

external forces due to mechanical strain changes in

elastic bodies, an therefore we proposed a whole de-

scription of each stage and the components required

to guarantee an optimal performance and ﬂexibility

to select different Wheatstone bridge circuit conﬁgu-

rations depending on the user requirements.

Meneses, H., Jarquin, V., Miranda, Y., Cordero, C., Delgado, N., Vargas, K. and Ruíz, F.

A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications.

DOI: 10.5220/0012238800003543

In Proceedings of the 20th International Conference on Informatics in Control, Automation and Robotics (ICINCO 2023) - Volume 2, pages 211-218

ISBN: 978-989-758-670-5; ISSN: 2184-2809

211

The paper is organized as follows: Section 2

presents the functionalities of the printed circuit

board, Section 3 shows the printed circuit board de-

sign, Section 4 shows the economic cost, Section 5

presents a comparison with some commercial acqui-

sition boards and ﬁnally, Section 6 presents the main

results of the printed circuit board design.

2 SYSTEM CONFIGURATION

The printed circuit board (PCB) is composed by four

main blocks as can be seen in Fig. 1. The power

supply circuits responsible to transfer required energy

to achieve the different functionalities and conﬁgura-

tions, the Wheatstone bridge circuits used to capture

the resistance change due to the mechanical defor-

mation on the elastic parts, the ampliﬁcation system

in charge of amplifying voltage signal coming from

Wheatstone bridge in order to have a suitable reading

in the analog to digital converters and the microcon-

troller responsible for signals processing to estimate

external force values.

Power

Supply

System

Wheatstone

Bridge

Circuits

Ampliﬁcation

System

Micro-

controller

Figure 1: Printed circuit board system conﬁguration.

2.1 Power Supply System

The power supply system is composed by three

stages. The ﬁrst one shown in Fig. 2 is responsible for

capturing the energy from a 12 V battery or a similar

system and it has an inverse polarity protection based

on a P-Channel MOSFET to avoid a damage in the

rest of the system due to a wrong user connection. A

similar protection circuit is recommended by (Scrim-

izzi et al., 2016) because other solutions based on a

diode entails higher power losses and a circuit protec-

tion based on a N-Channel MOSFET requires an ad-

ditional driver circuit composed by a charge pump cir-

cuit and EMI ﬁlter. As it is mentioned by (ONSEMI,

2023), when a reverse polarity protection based on a

P-Channel MOSFET is used, to turn on a P-Channel,

the gate voltage needs to be lower than the source

voltage by at least the threshold voltage speciﬁed by

the manufacturer and this requirement is fulﬁlled with

a right connection using the circuit shown in Fig. 2,

but when the battery is reversely connected, the gate

and source voltage are practically the same and there-

fore, the P-channel is turn off. Note, that there is a

solder bridge jumper in parallel with a MOSFET tran-

sistor if the user decides to do not use that protections

for any reason. Also, it can be seen several capacitors

that deal with battery voltage changes and provide a

low impedance path to high frequency noise coming

from the battery voltage.

1.5 A

SJ12P

JP1

+12V

PWR_Conn

Figure 2: Main power system.

The second one is connected to the previous stage

and it can be seen in Fig. 3. It is composed by a 9

V voltage regulator that supplies a 9 V constant volt-

age to the Wheatstone bridge in order to have a higher

voltage due to the electrical resistance change in com-

parison to the obtained when the Wheatstone bridge is

power to typical voltages values as 5 V or 3.3 V. Note,

that it is also possible to use 12 V coming from the

battery to power the Wheatstone bridge closing the

solder bridge jumper located parallel to the 9 V volt-

age regulator. Moreover, in the output of the voltage

regulator there is a diode to protect it in case of cur-

rent coming from inverse direction. Also, the capac-

itors in this stage perform similar functions to those

mentioned above: regulate voltage changes and ﬁlter

high frequency noise. This stage also provides the re-

quired voltage level by the operational ampliﬁer that

will be shown further.

Vin

Vout

GND

JP2

12V_reg_by

9V_EN

D29

+12V

Figure 3: 9 V voltage regulator system.

The last stage of the power system is shown in

Fig. 4. It is composed mainly by a 5 V voltage regu-

lator whose power supply can come from 9 V voltage

regulator or from 12 V battery. The output voltage

of this regulator is employed to power the microcon-

troller STM32F407 Discovery as well as a 1.6 V ref-

erence voltage chip used by the ampliﬁcation voltage

system. The capacitors shown in this stage also exe-

cute the same functions of the capacitors mentioned

above.

2.2 Wheatstone Bridge Circuits

The PCB has eight Wheatstone bridge circuits that

can be implemented as quarter, half or full bridge con-

ﬁguration as it can be seen in Fig. 5 selecting prop-

ICINCO 2023 - 20th International Conference on Informatics in Control, Automation and Robotics

212

+9V

Vin

Vout

GND

C10

5V_EN

+12V

+5V

9vregto5V

JP4

Figure 4: 5 V voltage regulator system.

erly the solder bridge jumpers JP1, JP2, JP3, JP4,

JPV1, JPV2, JPV3 and JPV4. Note that RV1, RV2,

RV3, and RV4 are 50 Ω trimmers that are in series

with either a strain gauge of typical values of 120 Ω

or 350 Ω (Gauge 1, Gauge 2, Gauge 3 or Gauge 4)

or with a 100 Ω or 330 Ω resistor (R1, R2, R3 or R4)

and they allow to adjust an equal resistance on each

Wheatstone bridge arm in order to have a null voltage

generation when no force is applied.

+5 V

Gauge 1

Gauge 2

RV1

JP1

JPV1

RV2

JP2

JPV2

RV3

JP3

JPV3

RV4

JP4

JPV4

Gauge 4

Gauge 3

V+

JP5

+9 V

JP6

V-

Figure 5: Wheatstone bridge.

The output voltage V

coming from the Wheat-

stone bridge circuit is given by:

= V + −V − = V cc ·



+ R

−

+ R



(1)

where R

is the i-th strain gauge resistance (i = 1,2

on the right Wheatstone bridge arm and i = 3,4 on the

left Wheatstone bridge arm) and V

could be either 9

V or 5 V as it is shown in Fig. 5. If R

= R

and R

= R

, then:

= V

−V

−

= V cc ·



− R

+ R



(2)

Note that V

> 0 if R

> R

and this happen when

both strain gauges 2 and 4 or any of them operate

in tension (resulting in increased resistance) and both

strain gauges 1 and 3 or any of them operate in com-

pression (resulting in decreased resistance). When the

+5 V

JP7

+9 V

JP8

RV6

RV5

GND

OUT

V-

V+

C12

C13

C11

+3.3V

JP7

+1.6V

Reference

+5 V

Figure 6: Voltage ampliﬁcation system.

mechanical deformation happens in the inverse direc-

tion the voltage output is V

< 0 and therefore, it is

possible to have positive and negative voltage values

according to the direction of the external force applied

on the force-torque sensor.

2.3 Voltage Ampliﬁcation System

In order to have a better reading of the voltage signals

coming from the Wheatstone bridge circuits, an oper-

ational ampliﬁer with instrumentation characteristics

was chosen as it can be seen in Fig. 6. For this PCB

the TLV9154QDRQ1 was chosen. Among its main

features, there is a typical bandwidth of 4.5 MHz, a

slew rate of 21 V/ µs and a common-mode rejection

ratio of 125 dB.

At it is shown in this ﬁgure, a 1.6 V voltage reference

chip is required to get a voltage offset different from

zero (1.6 V) as output of the ampliﬁcation system.

Therefore, the voltage output V

is given by:

RV 5



1 +

RV 6





1 +

RV 5



−

RV 6

−



1 +

RV 6





1 +

RV 5



1.6

(3)

Note that trimmers RV 5 and RV 6 are adjusted in

such way that relation (4) is accomplished:

RV 6

RV 5

(4)

Therefore, the voltage output can be expressed as:

RV 6

−V

−

) + 1.6 (5)

where the term

RV 6

represents the ampliﬁcation gain.

3 PRINTED CIRCUIT BOARD

DESIGN

The printed circuit board was designed using KiCad

7.0 which is an open source software developed for

A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications

213

electronics circuits design. It offers an schematic cap-

ture where electrical diagram is created as well as a

PCB layout where the location of the different com-

ponents is made and important characteristics as track

width, via size, clearance, power and ground planes,

and PCB layer stackup are deﬁned.

3.1 PCB Layer Stackup

The general purpose of this printed circuit board is

sending all the voltage signals to the analog to digital

converts in an accurate and quickly way. A good prac-

tice to do that is through the use of impedance control

which avoids distortion, attenuation and reﬂection of

the signals and improves the reliability of the mea-

surements that are performed within the PCB (Zhang

et al., 2011).

For this design, the standard JLC04161H-7628

(https://jlcpcb.com/impedance) shown in Tab. 1 was

chosen as an option for impedance control because

it is a standard used for high data transmission ap-

plications (Circuits, 2020), as this case. This four

layer conﬁguration was also chosen because it allows

connections between all the electrical components de-

spite their large number.

Table 1: Dielectric Speciﬁcations LC04161H-7628

(https://jlcpcb.com/impedance).

Layer Material Tickness (mm)

L1 Outer Copper Weight, 1 oz A 0.0350

Prepreg 7628, RC 49%, 8.6 mil A 0.2104

L2 Inner Copper Weight A 0.0152

Core 1.1mm H/HOZ with copper A 1.0650

L3 Inner Copper Weight 0.0152

Prepreg 7628, RC 49%, 8.6 mil A 0.2104

L4 Outer Copper Weight, 1 oz 0.0350

A visual distribution of the layer stackup is shown

in Fig. 7. In our case, L1 layer corresponds to the

front copper layer where most of surface mounting

device (SMD) components are positioned in order to

facilitate the assembly process using a pick-and-place

machine (P&P) and a soldering oven as it can be seen

in Fig. 9. All the trimmers were selected as through-

hole technology because they are cheaper than other

technologies and they were mounted on this layer

to facilitate their resistance adjustment. The strain

gauge connectors are also mounting on this layer. L2

layer represents the ground plane, L3 layer the power

planes which has the distributions of the different

voltage level required by the PCB as it can be seen

in Fig. 8. Layer L4 corresponds to the back copper

layer which has the power connector, voltage regula-

tors and few smd components as capacitors as it can

be seen in Fig. 10.

Prepreg

Core

Prepreg

Figure 7: The JLC04161H-7628 (Standard) stackup offered

by JLCPCB implemented in the PCB design.

1.6 V

5 V

3.3 V

12 V

9 V

1.6 V

Figure 8: Power Plane Distribution.

3.2 Net Classes Conﬁguration

In Kicad it is possible to deﬁne a set of nets that have

the same parameters to route these nets and this is

called as Net Classes. This is very useful to deﬁne

the most important parameters for proper implemen-

tation of PCB traces. The parameters of these classes

were deﬁned as follows:

• Clearance: minimum values are used with an ad-

ditional 30 % margin to provide a suitable mar-

gin, following the electrical spacing speciﬁed by

the IPC 2221 standard (The Institute for Intercon-

necting and Packaging Electronic Circuits, 1998).

Please note that these values are intended for un-

coated external components (A6).

• Track Width: it was calculated by using the for-

mula (6) speciﬁed in the IPC 2221 standard con-

sidering a temperature change of 10 degrees Cel-

sius and the estimated current values shown in

ICINCO 2023 - 20th International Conference on Informatics in Control, Automation and Robotics

214

Figure 9: Components distribution on frontal layer.

Figure 10: Components distribution on back layer.

Tab. 2 for the deﬁned Net Classes. Note that

Analog Signal refers mainly to the current signals

crossing the Wheatstone bridge circuits and the

ampliﬁcation voltage system, the GND Analog

refers to the current crossing the ground plane and

the rest of Net Classes refer to the circulating cur-

rent in a stage with an speciﬁc voltage level. The

remaining variables for track width calculation

were set according to the speciﬁcations outlined in

the IPC 2221 standard (The Institute for Intercon-

necting and Packaging Electronic Circuits, 1998).

I = K · ∆T

0.44

· (W · H)

0.725

(6)

• Via Hole: typically, it has the same value as the

track width because the width of the track should

always have a Via Hole of at least the same size to

accommodate the track. A minimum value of 0.3

mm was set to minimize economic cost, consid-

ering the purchase options available by JLCPCB

manufacturer. A large Via Hole size improves

heat dissipation (Singh et al., 2019).

• Via Size: it is advisable to use a value twice the

size of the Via Hole. For example, if a Via Hole of

0.3 mm is used, a Via Size of 0.6 mm ensures an

annular ring of 0.15 mm (JLCPCB, 2023). This

helps to minimize costs, considering the options

available at JLCPCB manufacturer for instance.

• uVia Size: microvias that connect inner layers

with outer layers maintain the same value as their

corresponding Via Size. This is done to reduce

costs.

• uVia Hole: microvias that connect inner layers

with outer layers maintain the same value as their

corresponding Via Hole. This is done to reduce

economic cost.

Table 2: Current calculations for different Net Classes on

the PCB.

Net Class Current Current + 30%

Analog Signal 0.160 A 0.208 A

GND Analog 1.673 A 2.391 A

Power Analog 1.6V 0.012 A 0.0156 A

Power Analog 12V 1.10 A 1.57 A

Power Analog 3V 0.263 A 0.342 A

Power Analog 5V 0.693 A 0.990 A

Power Analog 9V 1.10 A 1.57 A

Consequently. the Net classes parameters deﬁned

in KiCad are shown in Tab. 3 and 4.

Table 3: NetClasses parameters used in PCB design accord-

ing to the track requirements.

Net Class Clearance Track Width Via Size

Default 0.16 mm 0.16 mm 0.6 mm

Analog Signal 0.16 mm 0.16 mm 0.6 mm

GND Analog 0.4 mm 1 mm 2 mm

Power Analog 1.6V 0.16 mm 0.16 mm 0.6 mm

Power Analog 12V 0.25 mm 0.56 mm 1.12 mm

Power Analog 3V 0.16 mm 0.16 mm 0.6 mm

Power Analog 5V 0.16 mm 0.3 mm 0.6 mm

Power Analog 9V 0.25 mm 0.56 mm 1.12 mm

Table 4: NetClasses parameters used in PCB design accord-

ing to the track requirements.

Net Class Via Hole uVia Size uVia Hole

Default 0.3 mm 0.6 mm 0.3 mm

Analog Signal 0.3 mm 0.6 mm 0.3 mm

GND Analog 1 mm 2 mm 1 mm

Power Analog 1.6V 0.3 mm 0.6 mm 0.3 mm

Power Analog 12V 0.56 mm 1.12 mm 0.56 mm

Power Analog 3V 0.3 mm 0.6 mm 0.3 mm

Power Analog 5V 0.3 mm 0.6 mm 0.3 mm

Power Analog 9V 0.56 mm 1.12 mm 0.56 mm

A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications

215

4 PCB ECONOMIC COST

The list of components used for the PCB design is

shown in Tab. 5 and 6. It contains the part num-

ber of each component, its price, the type of assem-

bly: through-hole (T-H) or SMD as well as the re-

quired quantity. The total estimated cost including the

STM32F407 Discovery microcontroller was $62.75.

The acronyms used in this list are: Op Amps for op-

erational ampliﬁers, G for gauge, P for power, R for

resistor, T for trimmer, C for capacitor and V for volt-

age.

Table 5: List of components for the printed circuit board.

Component Qty Price

Op Amps 2 $3.300

G Connector 32 $4.096

P Connector 1 $0.129

R 100kΩ 16 $0.019

R 2kΩ 1 $0.001

R 1kΩ 9 $0.009

R 680Ω 1 $0.001

R 330Ω 40 $0.048

R 100Ω 32 $0.038

T 50Ω 32 $3.936

T 1kΩ 16 $1.024

C 0.16uF 10 $7.520

C 0.47uF 1 $0.026

C 100uF 1 $0.073

C 2.2uF 2 $0.016

C 10uF 2 $0.015

V. References 2 $6.580

MOSFET 40V 1 $0.546

Fuse 2A 1 $0.099

Regulator 9V 1 $3.350

Regulator 5V 1 $3.370

Rectiﬁer diode 2 $3.370

LED 3 $0.014

STM32F407 1 $21.170

Schottky Diodes 8 $0.640

PCB Fabrication 1 $6.440

Header 4 $0.268

5 COMPARISON WITH

COMMERCIAL DATA

ACQUISITION SYSTEMS

In order to prove the effectiveness of the printed cir-

cuit board, several data acquisition boards composed

by Wheatstone bridge circuits were analysed. The

outstanding features are shown in Tab. 7. As it can

Table 6: List of components for the printed circuit board.

Component Part number Assembly

Op Amps TLV9154QDRQ1 SMD

G Connector JST XH-2 T-H

P Connector Terminal Block 2 pin T-H

R 100kΩ WCR0805-100KFI SMD

R 2kΩ ERJ-6ENF2001V SMD

R 1kΩ ERJ-3EKF1001V SMD

R 680Ω ERJ-6ENF6200V SMD

R 330Ω ASC0805-330RFT5 SMD

R 100Ω PCF0805R-100RBT1 SMD

T 50Ω 3224W T-H

T 1kΩ 3224W T-H

C 0.16uF C0805C104Z4VACTU SMD

C 0.47uF 885012207049 SMD

C 100uF 865080343009 SMD

C 2.2uF 885012107012 SMD

C 10uF C2012JB1C106M085AC SMD

V. References MAX6018BEUR16+T SMD

MOSFET 40V DMP4047SK3-13 SMD

Fuse 2A C1Q 2 SMD

Regulator 9V R-78K9.0-1.0 T-H

Regulator 5V mEZD71201A-G T-H

Rectiﬁer diode FM4004W-W SMD

LED 156120RS75300 SMD

STM32F407 STM32F407G-DISC1 T-H

Schottky Diodes RB751S40T5G SMD

PCB Fabrication 4 layers -

Header Connector T-H

be seen only two of them allow quarter, half or full

bridge conﬁgurations which is a relevant characteris-

tic depending of the force-torque sensor available to

the user and using our PCB design we can reach any

of these conﬁgurations. Moreover, only one has up to

16 Wheatstone bridge circuits, but its price is around

ten times more expensive than our design. In relation

with the amount of samples measured by second, four

data acquisition boards reach up to 14400 but in our

case we considered the STM32F407 Discovery which

has analog to digital converters that can work in order

of MHz (ST, 2022).

Table 7: Characteristics of Commercial Data Acquisition

Boards (Windmill Software, 2015), (DATAQ Instruments,

2019),(DATAQ Instruments, 2014), (DATAQ Instruments,

2018), (Data Translation, 2017).

Data

Acquisition

Board

Bridge

Type

Strain

Gage

Input

Modules

ADC (samples

/second

per channel)

Price

DI-718Bx-S Full bridge 6 14400 $1495

DI-4718B-U Full bridge 6 14400 $695

DI-4718B-E Full bridge 6 14400 $795

DI-718B-ES Full bridge 6 14400 $895

DT9829-8

Quarter-bridge,

Half-bridge,

Full-bridge

8 120 $2159

751-SG

Quarter-bridge,

Half-bridge,

Full-bridge

16 48 $739.22

ICINCO 2023 - 20th International Conference on Informatics in Control, Automation and Robotics

216

6 CONCLUSIONS

This paper proposed a low-cost printed circuit board

which can be easily reconﬁgurable to work with dif-

ferent force-torque sensors based on strain gauges.

Moreover it has an impedance control layer stackup

to allow fast and reliable data transmission and other

methods as ground stitching are employed to reduce

electromagnetic interference. Besides, the compo-

nents distributions were made in order to carry out

a fast assembly process of SMD components using

a pick-and-place machine and a solder oven. It is

intended that this design can be useful to the user

that requires a low cost system to measure forces in

robotics applications.

ACKNOWLEDGEMENTS

This work has been supported by the Instituto de In-

vestigaciones en Ingenier

ıa as well as the School of

Electrical Engineering from the University of Costa

Rica.

REFERENCES

Aguirre-Ollinger, G. and Yu, H. (2021). Omnidirectional

platforms for gait training: Admittance-shaping con-

trol for enhanced mobility. Journal of Intelligent &

Robotic Systems, 101(3):52.

Armleder, S., Dean-Leon, E., Bergner, F., and Cheng, G.

(2022). Interactive force control based on multimodal

robot skin for physical human-robot collaboration.

Advanced Intelligent Systems, 4(2):2100047.

Bussmann, K., Dietrich, A., and Ott, C. (2018). Whole-

body impedance control for a planetary rover with

robotic arm: Theory, control design, and experimental

validation. In 2018 IEEE International Conference on

Robotics and Automation (ICRA), pages 910–917.

Calanca, A., Muradore, R., and Fiorini, P. (2016). A re-

view of algorithms for compliant control of stiff and

ﬁxed-compliance robots. IEEE/ASME Transactions

on Mechatronics, 21(2):613–624.

Chen, D., Song, A., and Li, A. (2015). Design and cal-

ibration of a six-axis force/torque sensor with large

measurement range used for the space manipulator.

Procedia Engineering, 99:1164–1170. 2014 Asia-

Paciﬁc International Symposium on Aerospace Tech-

nology, APISAT2014 September 24-26, 2014 Shang-

hai, China.

Cheng, G., Dean-Leon, E., Bergner, F., Rogelio Guadar-

rama Olvera, J., Leboutet, Q., and Mittendorfer, P.

(2019). A comprehensive realization of robot skin:

Sensors, sensing, control, and applications. Proceed-

ings of the IEEE, 107(10):2034–2051.

Circuits, S. (2020). High-speed pcb design guide. pages

30-32.

Data Translation (2017). Dt9828 usb multi-sensor measure-

ment module. Datasheet. https://www.mccdaq.com/

PDFs/specs/DT9829-Datasheet.pdf.

DATAQ Instruments (2014). Di-718b 8b module data

logger system. Datasheet. https://www.dataq.com/

resources/pdfs/datasheets/di718b ds.pdf.

DATAQ Instruments (2018). Di-718bx 8b module data

logger. Datasheet. https://www.dataq.com/resources/

pdfs/datasheets/di718bx ds.pdf.

DATAQ Instruments (2019). Di-4718b usb or eth-

ernet data acquisition (daq) system. Datasheet.

https://www.dataq.com/resources/pdfs/datasheets/di-

4718b-data-logger-ds.pdf .

Dean, E., Ramirez-Amaro, K., Bergner, F., and Cheng, G.

(2019). Robot skin: Fully-compliant control frame-

work using multi-modal tactile events. P

ADI Bolet

ın

Cient

ıﬁco de Ciencias B

asicas e Ingenier

ıas del ICBI,

7(Especial 1).

Dietrich, A., Bussmann, K., Petit, F., Kotyczka, P., Ott, C.,

Lohmann, B., and Albu-Sch

affer, A. (2016). Whole-

body impedance control of wheeled mobile manipula-

tors. Autonomous Robots, 40(3):505–517.

emy, J., Ferland, F., Lauria, M., and Michaud, F. (2014).

Force-guidance of a compliant omnidirectional non-

holonomic platform. Robotics and Autonomous Sys-

tems, 62(4):579–590.

Iskandar, M., Quere, G., Hagengruber, A., Dietrich, A., and

Vogel, J. (2019). Employing whole-body control in

assistive robotics. In 2019 IEEE/RSJ International

Conference on Intelligent Robots and Systems (IROS),

pages 5643–5650.

JLCPCB (2023). Pcb manufacturing & assembly capabil-

ities. https://jlcpcb.com/capabilities/pcb-capabilities.

Last update on July 24, 2023.

Kebede, G. A., Ahmad, A. R., Lee, S.-C., and Lin, C.-

Y. (2019). Decoupled six-axis force–moment sensor

with a novel strain gauge arrangement and error re-

duction techniques. Sensors, 19(13).

Kim, K. S., Kwok, A. S., Thomas, G. C., and Sen-

tis, L. (2014). Fully omnidirectional compliance in

mobile robots via drive-torque sensor feedback. In

2014 IEEE/RSJ International Conference on Intelli-

gent Robots and Systems, pages 4757–4763.

Kim, K. S., Llado, T., and Sentis, L. (2016). Full-body

collision detection and reaction with omnidirectional

mobile platforms: a step towards safe human-robot in-

teraction. Autonomous Robots, 40(2):325–341.

Kollmitz, M., B

uscher, D., Schubert, T., and Burgard, W.

(2018). Whole-body sensory concept for compli-

ant mobile robots. In 2018 IEEE International Con-

ference on Robotics and Automation (ICRA), pages

5429–5435.

Lin, C.-C., Su, C.-Y., Lin, S.-T., Chen, C.-Y., Yeh, C.-N.,

Lin, C.-H., Wang, L.-W., Kuo, S.-Y., and Chien, L.-J.

(2019). 6-dof force/torque sensor. In 2019 14th Inter-

national Microsystems, Packaging, Assembly and Cir-

cuits Technology Conference (IMPACT), pages 191–

194.

A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications

217

Mittendorfer, P. a. G. (2012). 3d surface reconstruc-

tion for robotic body parts with artiﬁcial skins. In

2012 IEEE/RSJ International Conference on Intelli-

gent Robots and Systems, pages 4505–4510.

Nozawa, S., Ishida, M., Ueda, R., Kakiuchi, Y., Okada, K.,

and Inaba, M. (2011). Full-body motion control inte-

grated with force error detection for wheelchair sup-

port. In 2011 11th IEEE-RAS International Confer-

ence on Humanoid Robots, pages 193–198.

Oda, M., Zhu, C., Suzuki, M., Luo, X., Watanabe, H.,

and Yan, Y. (2010). Admittance based control of

wheelchair typed omnidirectional robot for walking

support and power assistance. In 19th International

Symposium in Robot and Human Interactive Commu-

nication, pages 159–164.

ONSEMI (2023). MOSFET Selection for Re-

verse Polarity Protection AND90146/D.

https://www.onsemi.com/download/application-

notes/pdf/and90146-d.pdf. Rev. 1.

Phan, T.-P., Chao, P. C.-P., Cai, J.-J., Wang, Y.-J., Wang, S.-

C., and Wong, K. (2018). A novel 6-dof force/torque

sensor for cobots and its calibration method. In 2018

IEEE International Conference on Applied System In-

vention (ICASI), pages 1228–1231.

Prabakaran, V., Elara, M. R., Pathmakumar, T., and Nansai,

S. (2018). Floor cleaning robot with reconﬁgurable

mechanism. Automation in Construction, 91:155–

165.

Scrimizzi, F., Longo, G., and Gambino, G. (2016).

Automotive-grade p-channel power mosfets for static,

dynamic and repetitive reverse polarity protection.

In PCIM Europe 2016; International Exhibition and

Conference for Power Electronics, Intelligent Motion,

Renewable Energy and Energy Management, pages 1–

Sentis, L., Petersen, J., and Philippsen, R. (2013). Im-

plementation and stability analysis of prioritized

whole-body compliant controllers on a wheeled hu-

manoid robot in uneven terrains. Autonomous Robots,

35(4):301–319.

Singh, S., Singh, A., Singh, A., and Singh, S. (2019). Study

on pcb designing problems and their solutions. In

2019 International Conference on Power Electronics,

Control and Automation (ICPECA), page 4.

ST (2022). An2834 application note how to get the best adc

accuracy in stm32 microcontrollers.

Sun, Y., Liu, Y., Jin, M., and Liu, H. (2013). Design and op-

timization of a novel six-axis force/torque sensor with

good isotropy and high sensitivity. In 2013 IEEE In-

ternational Conference on Robotics and Biomimetics

(ROBIO), pages 631–638.

Templeman, J. O., Sheil, B. B., and Sun, T. (2020). Multi-

axis force sensors: A state-of-the-art review. Sensors

and Actuators A: Physical, 304:111772.

The Institute for Interconnecting and Packaging Electronic

Circuits (1998). Ipc-2221: Generic standard on

printed board design. pages 38,41-42.

Valizadeh, A., Akbarzadeh, A., and Heravi, M. H. T. (2015).

Effect of structural design parameters of a six-axis

force/torque sensor using full factorial design. In

2015 3rd RSI International Conference on Robotics

and Mechatronics (ICROM), pages 789–793.

Windmill Software (2015). 751-sg user manual. Datasheet.

https://www.windmill.co.uk/help/751sg.pdf.

Wong, C., Yang, E., Yan, X.-T., and Gu, D. (2018). Au-

tonomous robots for harsh environments: a holistic

overview of current solutions and ongoing challenges.

Systems Science & Control Engineering, 6(1):213–

219.

Yuan, C., Luo, L.-P., Yuan, Q., Wu, J., Yan, R.-J., Kim,

H., Shin, K.-S., and Han, C.-S. (2015). Development

and evaluation of a compact 6-axis force/moment sen-

sor with a serial structure for the humanoid robot foot.

Measurement, 70:110–122.

Zhang, M.-S., Mao, J.-F., and Long, Y.-L. (2011). Power

noise suppression using power-and-ground via pairs

in multilayered printed circuit boards. IEEE Transac-

tions on Components, Packaging and Manufacturing

Technology, 1(3):374–385.

ICINCO 2023 - 20th International Conference on Informatics in Control, Automation and Robotics

218