Expanding the Scope and Increasing the Functionality of Digital Twins by Integrating Thermal Simulations

Dorit Kaufmann, Jannis Weid, Jürgen Rossmann

2023

Abstract

The simulation of components, systems and processes is an established tool in research and development nowadays. When it comes to complex systems and the interaction of components and disciplines, it is crucial to consider all relevant aspects, thus creating a powerful Digital Twin (DT) of a technical asset. In this work, an existing simulation framework for DT will be extended by an interface to Thermal Simulations. The latter one are still widely used as a stand-alone tool due to difficulties on linking the respective models and methods. Thus, the developed approach has its access point in the DT simulation framework and conducts the thermal calculations to an external Finite Element Analysis (FEA) solver by exchanging only characteristic variables. This concept is used as a base for the development of extensions for the DT whose basic functions are the import and preparation of geometric structures for both models, the management of the calculations of the external FEA solver and the visual representation of determined temperature distributions and heat fluxes in the DT.

Paper Citation

in Harvard Style

Kaufmann D., Weid J. and Rossmann J. (2023). Expanding the Scope and Increasing the Functionality of Digital Twins by Integrating Thermal Simulations. In Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH; ISBN 978-989-758-668-2, SciTePress, pages 259-266. DOI: 10.5220/0012081600003546

in Bibtex Style

@conference{simultech23,
author={Dorit Kaufmann and Jannis Weid and Jürgen Rossmann},
title={Expanding the Scope and Increasing the Functionality of Digital Twins by Integrating Thermal Simulations},
booktitle={Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH},
year={2023},
pages={259-266},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0012081600003546},
isbn={978-989-758-668-2},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 13th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH
TI - Expanding the Scope and Increasing the Functionality of Digital Twins by Integrating Thermal Simulations
SN - 978-989-758-668-2
AU - Kaufmann D.
AU - Weid J.
AU - Rossmann J.
PY - 2023
SP - 259
EP - 266
DO - 10.5220/0012081600003546
PB - SciTePress