A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications

H. Meneses, V. Jarquin, Y. Miranda, C. Cordero, N. Delgado, K. Vargas, F. Ruíz

2023

Abstract

This paper presents a low-cost printed circuit board designed to measure external forces in several robotics applications. Its operating principle is based on capturing electrical resistance change coming from strain gauges attached to deformable beams in elastic force-torque sensors. This system offers great flexibility because users can adjust up to 8 Wheatstone bridge circuit in different configurations depending on their needs, their parameters as offset and amplification gain can easily be configured and the assembly process is intended to be fast using a pick-and-place machine and a soldering oven.

Paper Citation

in Harvard Style

Meneses H., Jarquin V., Miranda Y., Cordero C., Delgado N., Vargas K. and Ruíz F. (2023). A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications. In Proceedings of the 20th International Conference on Informatics in Control, Automation and Robotics - Volume 2: ICINCO; ISBN 978-989-758-670-5, SciTePress, pages 211-218. DOI: 10.5220/0012238800003543

in Bibtex Style

@conference{icinco23,
author={H. Meneses and V. Jarquin and Y. Miranda and C. Cordero and N. Delgado and K. Vargas and F. Ruíz},
title={A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications},
booktitle={Proceedings of the 20th International Conference on Informatics in Control, Automation and Robotics - Volume 2: ICINCO},
year={2023},
pages={211-218},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0012238800003543},
isbn={978-989-758-670-5},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 20th International Conference on Informatics in Control, Automation and Robotics - Volume 2: ICINCO
TI - A Low-Cost Printed Circuit Board Design for External Force Measuring in Robotic Applications
SN - 978-989-758-670-5
AU - Meneses H.
AU - Jarquin V.
AU - Miranda Y.
AU - Cordero C.
AU - Delgado N.
AU - Vargas K.
AU - Ruíz F.
PY - 2023
SP - 211
EP - 218
DO - 10.5220/0012238800003543
PB - SciTePress