Towards Multi-Level-Simulation using Dynamic Cloud Environments

Stefan H. A. Wittek, Michael Göttsche, Andreas Rausch, Jens Grabowski

2016

Abstract

The engineering of cyber physical systems requires holistic simulation perspectives. To cope with the complexity of these systems, we aim to provide a simulation methodology that is efficient regarding model complexity. The required holistic perspective is reached on a coarse level, which is co-simulated with multiple detailed models of some areas of the system that are of particular interest to the investigated phenomena. Which areas are thus “zoomed in” is dynamic during a simulation run. To reflect this, the resulting Multi-Level-Simulation is deployed in a dynamic cloud environment, using the provided hardware resources in a cost-efficient manner.

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Paper Citation


in Harvard Style

Wittek S., Göttsche M., Rausch A. and Grabowski J. (2016). Towards Multi-Level-Simulation using Dynamic Cloud Environments . In Proceedings of the 6th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH, ISBN 978-989-758-199-1, pages 297-303. DOI: 10.5220/0005997502970303


in Bibtex Style

@conference{simultech16,
author={Stefan H. A. Wittek and Michael Göttsche and Andreas Rausch and Jens Grabowski},
title={Towards Multi-Level-Simulation using Dynamic Cloud Environments},
booktitle={Proceedings of the 6th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH,},
year={2016},
pages={297-303},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0005997502970303},
isbn={978-989-758-199-1},
}


in EndNote Style

TY - CONF
JO - Proceedings of the 6th International Conference on Simulation and Modeling Methodologies, Technologies and Applications - Volume 1: SIMULTECH,
TI - Towards Multi-Level-Simulation using Dynamic Cloud Environments
SN - 978-989-758-199-1
AU - Wittek S.
AU - Göttsche M.
AU - Rausch A.
AU - Grabowski J.
PY - 2016
SP - 297
EP - 303
DO - 10.5220/0005997502970303