The Visual Inspection of Solder Balls in Semiconductor Encapsulation

Conceição Silva, Neandra Ferreira, Sharlene Meireles, Mario Otani, Vandermi J. da Silva, Carlos O. de Freitas, Felipe Oliveira

2022

Abstract

The growing demand for increasing memory storage capacity has required a high density of integration within the semiconductor encapsulation and, consequently, has made this process more complex and susceptible to failures during the production stage. In the semiconductor encapsulation area, the costs of materials and equipment are high and the profit margin is narrow, making it necessary to rigorously inspect the process steps to keep the productive activity viable. This work addresses the problem of quality control in silicon wafers soldering procedure, allowing error detection before the epoxy resin molding process, generating useful infor-mation for correcting equipment configurations and predicting failures from the raw materials and inputs used in the process. We propose an approach to classify solder balls, in the soldering process of silicon wafers on Ball Grid Array (BGA), contained in the Printed Circuit Board (PCB) substrates. The proposed methodology is composed of two main steps: i) Solder ball segmentation; and ii) Solder ball classification through deep learning. The proposed predictive model learns the relation between visual features and the different soldering conditions. Real and simulated experiments were carried out to validate the proposed approach. Results show the obtained accuracy of 99.4%, using Convolutional Neural Network (CNN) classification model. Furthermore, the proposed approach presents high accuracy even regarding noisy images, resulting in accuracy of 92.8% and 75.7% for a Salt and Pepper and Gaussian noise, respectively, in the worst scenario. Experiments demonstrate reliability and robustness, optimizing the manufacturing.

Paper Citation

in Harvard Style

Silva C., Ferreira N., Meireles S., Otani M., J. da Silva V., O. de Freitas C. and Oliveira F. (2022). The Visual Inspection of Solder Balls in Semiconductor Encapsulation. In Proceedings of the 19th International Conference on Informatics in Control, Automation and Robotics - Volume 1: ICINCO, ISBN 978-989-758-585-2, pages 750-757. DOI: 10.5220/0011357400003271

in Bibtex Style

@conference{icinco22,
author={Conceição Silva and Neandra Ferreira and Sharlene Meireles and Mario Otani and Vandermi J. da Silva and Carlos O. de Freitas and Felipe Oliveira},
title={The Visual Inspection of Solder Balls in Semiconductor Encapsulation},
booktitle={Proceedings of the 19th International Conference on Informatics in Control, Automation and Robotics - Volume 1: ICINCO,},
year={2022},
pages={750-757},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0011357400003271},
isbn={978-989-758-585-2},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 19th International Conference on Informatics in Control, Automation and Robotics - Volume 1: ICINCO,
TI - The Visual Inspection of Solder Balls in Semiconductor Encapsulation
SN - 978-989-758-585-2
AU - Silva C.
AU - Ferreira N.
AU - Meireles S.
AU - Otani M.
AU - J. da Silva V.
AU - O. de Freitas C.
AU - Oliveira F.
PY - 2022
SP - 750
EP - 757
DO - 10.5220/0011357400003271