Digital Twin Architecture of a Cyber-physical Assembly Transfer System

Matteo De Marchi, Rafael Rojas, Benedikt Mark, Tanel Aruväli, Erwin Rauch, Dominik Matt, Dominik Matt

2022

Abstract

In recent years, the introduction of Internet of Things ready devices set new standards in the exploitation of Industry 4.0 related concepts. The growing complexity of Cyber-Physical Systems makes industrial machinery to be more connected, interoperable, and controllable. Hereby, topics such as edge/cloud computing, cyber security, and sustainability are gaining considerable importance. In this scenario, the Digital Twin paradigm aims at establishing a safe and seamless integrated data flow from the physical world to the virtual one and vice versa, ensuring a constant optimization of the system and its real-time monitoring. This work aims to design and implement a DT architecture for a cyber-physical intelligent manufacturing line. The implementation of a DT node for a flexible transfer line allows users to simply interface it with other systems, such as collaborative and traditional industrial robots as well as to enable the smart routing and tracing of shuttles. The development of the technological demonstrator has been conducted at the Smart Mini Factory laboratory of the Free University of Bolzano.

Paper Citation

in Harvard Style

De Marchi M., Rojas R., Mark B., Aruväli T., Rauch E. and Matt D. (2022). Digital Twin Architecture of a Cyber-physical Assembly Transfer System. In Proceedings of the 3rd International Conference on Innovative Intelligent Industrial Production and Logistics - Volume 1: IN4PL, ISBN 978-989-758-612-5, pages 168-175. DOI: 10.5220/0011589900003329

in Bibtex Style

@conference{in4pl22,
author={Matteo De Marchi and Rafael Rojas and Benedikt Mark and Tanel Aruväli and Erwin Rauch and Dominik Matt},
title={Digital Twin Architecture of a Cyber-physical Assembly Transfer System},
booktitle={Proceedings of the 3rd International Conference on Innovative Intelligent Industrial Production and Logistics - Volume 1: IN4PL,},
year={2022},
pages={168-175},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0011589900003329},
isbn={978-989-758-612-5},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 3rd International Conference on Innovative Intelligent Industrial Production and Logistics - Volume 1: IN4PL,
TI - Digital Twin Architecture of a Cyber-physical Assembly Transfer System
SN - 978-989-758-612-5
AU - De Marchi M.
AU - Rojas R.
AU - Mark B.
AU - Aruväli T.
AU - Rauch E.
AU - Matt D.
PY - 2022
SP - 168
EP - 175
DO - 10.5220/0011589900003329