Reliability Analysis of LCCC Leaded Solder Joints Under Thermal Cyclic Loading Conditions

Zhang Yukun, Zhang Chun, Xu Weiling

2022

Abstract

In this paper, a finite element analysis model of the stress-strain of the solder joints of LCCC package devices is established to analyze the stress-strain of the solder joints of LCCC devices under temperature cyclic loading, and the effect of the substrate material on the thermal fatigue life of the solder joints is analyzed. The results show that the use of Al2O3, the same material as the LCCC package, as the substrate can effectively improve the thermal fatigue life of the solder joints under thermal cyclic loading conditions. In practical applications, the Al2O3 material transfer method can be used to improve the thermal fatigue life of LCCC package devices.

Paper Citation

in Harvard Style

Yukun Z., Chun Z. and Weiling X. (2022). Reliability Analysis of LCCC Leaded Solder Joints Under Thermal Cyclic Loading Conditions. In Proceedings of the 3rd International Symposium on Automation, Information and Computing - Volume 1: ISAIC; ISBN 978-989-758-622-4, SciTePress, pages 372-376. DOI: 10.5220/0011933300003612

in Bibtex Style

@conference{isaic22,
author={Zhang Yukun and Zhang Chun and Xu Weiling},
title={Reliability Analysis of LCCC Leaded Solder Joints Under Thermal Cyclic Loading Conditions},
booktitle={Proceedings of the 3rd International Symposium on Automation, Information and Computing - Volume 1: ISAIC},
year={2022},
pages={372-376},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0011933300003612},
isbn={978-989-758-622-4},
}

in EndNote Style

TY - CONF

JO - Proceedings of the 3rd International Symposium on Automation, Information and Computing - Volume 1: ISAIC
TI - Reliability Analysis of LCCC Leaded Solder Joints Under Thermal Cyclic Loading Conditions
SN - 978-989-758-622-4
AU - Yukun Z.
AU - Chun Z.
AU - Weiling X.
PY - 2022
SP - 372
EP - 376
DO - 10.5220/0011933300003612
PB - SciTePress